Altera Corporation
EPF6016BC256-3N
EPF6016BC256-3N ECAD Model
EPF6016BC256-3N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 5 V | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 204 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 4 DEDICATED INPUTS, 204 I/O | |
| Additional Feature | CAN ALSO BE USED 16000 LOGIC GATES | |
| Clock Frequency-Max | 133 MHz | |
| Output Function | MACROCELL | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.3 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF6016BC256-3N Datasheet Download
EPF6016BC256-3N Overview
The chip model EPF6016BC256-3N is a device designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with HDL language, which is a hardware description language used to program FPGA, CPLD, and other programmable logic devices.
The chip model EPF6016BC256-3N has been designed to provide high performance and reliability, and its application scenarios are suitable for a wide range of applications. It is capable of handling complex calculations and data processing tasks, and is suitable for applications such as image processing, machine learning, and artificial intelligence.
In terms of industry trends, the chip model EPF6016BC256-3N is expected to be widely adopted in the future. It is expected that the application environment will require the support of new technologies, such as the use of 5G networks and the development of new communication protocols.
The original design intention of the chip model EPF6016BC256-3N is to provide a reliable and cost-effective solution for digital signal processing and embedded processing applications. It is also designed to be scalable and upgradeable, allowing it to be used in more advanced communication systems in the future.
In conclusion, the chip model EPF6016BC256-3N is a device designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications. It is expected to be widely adopted in the future and will require the support of new technologies. It is also designed to be scalable and upgradeable, allowing it to be used in more advanced communication systems in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||