EPF6016AFC256-1N
EPF6016AFC256-1N
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rohs

Altera Corporation

EPF6016AFC256-1N


EPF6016AFC256-1N
F53-EPF6016AFC256-1N
Active
LOADABLE PLD, BGA
BGA

EPF6016AFC256-1N ECAD Model


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EPF6016AFC256-1N Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 3.3 V
Number of Dedicated Inputs 4
Number of I/O Lines 171
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Organization 4 DEDICATED INPUTS, 171 I/O
Clock Frequency-Max 172 MHz
Output Function MACROCELL
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Operating Temperature-Max 85 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 256

EPF6016AFC256-1N Datasheet Download


EPF6016AFC256-1N Overview



The chip model EPF6016AFC256-1N is a versatile chip that has been widely used in a variety of industries and applications. It is an advanced field programmable gate array (FPGA) that is designed to provide a high level of flexibility and performance. This chip model is compatible with many popular communication protocols, including Ethernet, USB, and Serial. It features a high-performance architecture and advanced features that make it an ideal choice for many applications.


The EPF6016AFC256-1N has been designed with the intention of providing maximum flexibility and performance in a variety of applications. It is capable of supporting a wide range of communication protocols and can be used in a variety of communication systems. This chip model is also capable of supporting advanced communication systems and can be used in a variety of advanced communication systems. It is also capable of supporting the latest communication technologies, such as 5G and Wi-Fi 6.


The chip model EPF6016AFC256-1N is expected to remain in high demand in the future. As more and more industries begin to adopt advanced communication systems, the demand for this chip model will only increase. This chip model is also expected to remain in high demand in the future due to its ability to support the latest communication technologies. It is expected that the demand for this chip model will continue to grow in the future as more and more industries begin to adopt advanced communication systems.


The EPF6016AFC256-1N is also capable of being upgraded in the future. This chip model can be upgraded to support new communication technologies, such as 5G and Wi-Fi 6. It is also capable of being upgraded to support new communication protocols and can be used in a variety of advanced communication systems. It is expected that the demand for this chip model will continue to grow in the future as more and more industries begin to adopt advanced communication systems.


In conclusion, the chip model EPF6016AFC256-1N is a versatile and highly advanced FPGA that is capable of supporting a wide range of communication protocols and can be used in a variety of communication systems. It is expected to remain in high demand in the future due to its ability to support the latest communication technologies. It is also capable of being upgraded in the future to support new communication protocols and can be used in a variety of advanced communication systems. The demand for this chip model is expected to continue to grow in the future as more and more industries begin to adopt advanced communication systems.



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