Altera Corporation
EPF6010ATI100-3
EPF6010ATI100-3 ECAD Model
EPF6010ATI100-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 71 | |
| Number of Outputs | 71 | |
| Number of Logic Cells | 880 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 71 | |
| Programmable Logic Type | LOADABLE PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 71 I/O | |
| Additional Feature | ALSO CONFIGURABLE WITH 5V VCC | |
| Clock Frequency-Max | 133 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.27 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP100,.63SQ,20 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF6010ATI100-3 Datasheet Download
EPF6010ATI100-3 Overview
The chip model EPF6010ATI100-3 is a device designed to provide a high-performance, low-power solution for a variety of applications. It is a field-programmable gate array (FPGA) designed to provide a high-performance, low-power solution for a variety of applications. It is manufactured by Altera Corporation, a leading provider of advanced semiconductor solutions.
The chip model EPF6010ATI100-3 is designed to provide a high-performance solution for a variety of applications, including high-speed data processing, image processing, communications, and embedded systems. It features a high-speed, low-power architecture, with a wide range of features and capabilities. It is capable of running multiple applications simultaneously and can support a variety of communication protocols.
The chip model EPF6010ATI100-3 has been designed to meet the needs of a variety of applications, including high-speed data processing, image processing, communications, and embedded systems. It is designed to provide a high-performance, low-power solution for a variety of applications. It is capable of running multiple applications simultaneously and can support a variety of communication protocols.
The chip model EPF6010ATI100-3 is designed to provide a high-performance, low-power solution for a variety of applications. It is designed to meet the needs of a variety of applications, including high-speed data processing, image processing, communications, and embedded systems. It is also designed to support a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and ZigBee.
Regarding the industry trends of the chip model EPF6010ATI100-3 and the future development of related industries, it is important to consider the specific technologies that will be needed in the application environment. As technology advances, the chip model EPF6010ATI100-3 may need to be upgraded in order to keep up with the changing needs of the industry. It is also important to consider the product description and specific design requirements of the chip model EPF6010ATI100-3, along with actual case studies and precautions.
The chip model EPF6010ATI100-3 is a powerful tool for a variety of applications. It is designed to provide a high-performance, low-power solution for a variety of applications. It is designed to meet the needs of a variety of applications, including high-speed data processing, image processing, communications, and embedded systems. It is also designed to support a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and ZigBee.
In order to ensure the success of the chip model EPF6010ATI100-3, it is important to consider the specific technologies that will be needed in the application environment. Additionally, it is important to consider the product description and specific design requirements of the chip model EPF6010ATI100-3, along with actual case studies and precautions. This will help to ensure that the chip model EPF6010ATI100-3 is able to meet the changing needs of the industry and provide a high-performance, low-power solution for a variety of applications.
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