Altera Corporation
EPF10K50SQI208-2
EPF10K50SQI208-2 ECAD Model
EPF10K50SQI208-2 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 400 ps | |
| Number of Inputs | 147 | |
| Number of Outputs | 147 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 147 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 147 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | FQFP, QFP208,1.2SQ,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 208 |
EPF10K50SQI208-2 Datasheet Download
EPF10K50SQI208-2 Overview
The chip model EPF10K50SQI208-2 is a cutting-edge model from the semiconductor and integrated circuit industry. It is designed to provide high performance and reliable operation in a variety of applications. With its advanced features and design, this chip model is able to meet the demands of modern communication systems, networks, and even intelligent scenarios.
The industry trends of the chip model EPF10K50SQI208-2 are constantly evolving, and the future development of related industries is dependent on the specific technologies that are needed. The original design intention of the chip model EPF10K50SQI208-2 was to provide a reliable and high-performance solution for a variety of applications. It is also possible to upgrade the chip model in the future to meet the demands of advanced communication systems.
The possible future applications of the chip model EPF10K50SQI208-2 are endless. It can be used in networks to facilitate data transfer and communication, and it can also be applied to intelligent scenarios to provide automated solutions. With its advanced features and design, it is possible for the chip model to be used in the era of fully intelligent systems.
In conclusion, the chip model EPF10K50SQI208-2 is a cutting-edge model from the semiconductor and integrated circuit industry that is designed to provide high performance and reliable operation in a variety of applications. Its industry trends and future development are dependent on the specific technologies that are needed, and it is possible to upgrade the chip model in the future to meet the demands of advanced communication systems. Furthermore, the possible future applications of the chip model are endless, and it can be used in networks, intelligent scenarios, and even the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||