Altera Corporation
EPF10K50EQC208-1
EPF10K50EQC208-1 ECAD Model
EPF10K50EQC208-1 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 500 ps | |
| Number of Inputs | 147 | |
| Number of Outputs | 147 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 147 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 147 I/O | |
| Additional Feature | 2880 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | 30.60 X 30.60 MM, 0.50 MM PITCH, PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EPF10K50EQC208-1 Datasheet Download
EPF10K50EQC208-1 Overview
The chip model EPF10K50EQC208-1 is a versatile, high-performance integrated circuit (IC) that offers a wide range of applications for digital signal processing, embedded processing, and image processing. It is designed to work with HDL language, which is a hardware description language used to describe the behavior of digital circuits. As such, it is perfect for the needs of modern embedded systems, which are becoming increasingly complex.
The EPF10K50EQC208-1 has many advantages. It is a highly integrated system-on-chip (SoC) that features a large number of digital signal processing (DSP) blocks and embedded processors, making it suitable for a wide range of applications. It also features advanced low-power consumption and high-speed performance, making it ideal for applications that require high performance and low power consumption. Furthermore, the chip is designed with upgradability in mind, making it easy to upgrade and maintain.
The demand for the EPF10K50EQC208-1 is expected to continue to grow due to its versatility and the wide range of applications it can be used for. It is ideal for a variety of industries, including automotive, consumer electronics, telecommunications, and medical. The chip is also expected to be increasingly used in advanced communication systems, as its upgradability and performance make it suitable for these applications.
The EPF10K50EQC208-1 was designed with the intention of providing a powerful and flexible IC for embedded systems. It is a highly integrated system-on-chip that features a large number of DSP blocks and embedded processors, making it suitable for a wide range of applications. The chip is also designed with upgradability in mind, making it easy to upgrade and maintain. This makes it suitable for advanced communication systems, as the chip can be upgraded to meet the needs of these systems.
Overall, the EPF10K50EQC208-1 is a versatile, high-performance IC that offers a wide range of applications for digital signal processing, embedded processing, and image processing. It is designed to work with HDL language, making it perfect for the needs of modern embedded systems. The chip also offers advanced low-power consumption and high-speed performance, making it ideal for applications that require high performance and low power consumption. Furthermore, the chip is designed with upgradability in mind, making it suitable for advanced communication systems. The demand for the EPF10K50EQC208-1 is expected to continue to grow due to its versatility and the wide range of applications it can be used for.
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3,734 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $249.2465 | $249.2465 |
| 10+ | $246.5664 | $2,465.6644 |
| 100+ | $233.1661 | $23,316.6090 |
| 1000+ | $219.7657 | $109,882.8700 |
| 10000+ | $201.0053 | $201,005.2500 |
| The price is for reference only, please refer to the actual quotation! | ||