Altera Corporation
EPF10K50EFI256-1
EPF10K50EFI256-1 ECAD Model
EPF10K50EFI256-1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 8.5 ns | |
| Number of Inputs | 191 | |
| Number of Outputs | 191 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 191 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 191 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K50EFI256-1 Datasheet Download
EPF10K50EFI256-1 Overview
The chip model EPF10K50EFI256-1 is a powerful and versatile integrated circuit (IC) designed to meet the demands of modern communication systems. It is a Field Programmable Gate Array (FPGA) which can be programmed to perform a wide range of tasks. This type of IC is ideal for applications that require high performance, low power consumption, and flexibility.
The EPF10K50EFI256-1 is a member of the Altera EPF family of FPGA devices. It combines the features of an embedded processor with the flexibility of a programmable logic device. This IC has the ability to process multiple tasks simultaneously, making it suitable for applications such as high-speed data transfer, image processing, and control systems.
The EPF10K50EFI256-1 is designed for use in a wide range of industries, including automotive, aerospace, telecommunications, and consumer electronics. It is also suitable for use in a variety of communication systems, including wireless, satellite, and fiber optics. This IC is capable of supporting the latest communication technologies, such as 5G, Wi-Fi 6, and LTE Advanced Pro.
The EPF10K50EFI256-1 is designed to be upgradable, allowing users to take advantage of new technologies as they become available. This IC is capable of supporting the latest communication protocols, such as Ethernet, USB, and Bluetooth. It also has built-in security features, such as encryption and authentication, which make it suitable for secure communication systems.
The EPF10K50EFI256-1 is expected to be in high demand in the future, as it is a powerful and versatile IC that can be used in a variety of industries and applications. Its ability to support the latest communication technologies and protocols makes it a valuable asset for businesses and organizations that require secure and reliable communication systems. Its upgradable design also ensures that it can be adapted to meet the changing needs of the industry.
In conclusion, the chip model EPF10K50EFI256-1 is an ideal choice for applications that require high performance, low power consumption, and flexibility. Its upgradable design and ability to support the latest communication technologies and protocols make it suitable for a wide range of industries and applications. As the demand for this type of IC is expected to continue to grow, it is likely to remain a valuable asset for businesses and organizations in the future.
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