Altera Corporation
EPF10K50EFC256-3
EPF10K50EFC256-3 ECAD Model
EPF10K50EFC256-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 800 ps | |
| Number of Inputs | 191 | |
| Number of Outputs | 191 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 191 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 191 I/O | |
| Additional Feature | 2880 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K50EFC256-3 Overview
The chip model EPF10K50EFC256-3 is a state-of-the-art, low-power, field-programmable gate array (FPGA) device from Intel. It is designed to meet the needs of high performance computing and communication applications. This chip model is capable of providing high-speed data transfer and processing capabilities, while consuming minimal power.
In terms of industry trends, the EPF10K50EFC256-3 is a highly sought-after chip model due to its advanced features, such as its low power consumption, high speed, and high performance. It is also compatible with many communication protocols, making it suitable for a wide range of applications. As such, the EPF10K50EFC256-3 is becoming increasingly popular in the industry and is expected to continue to grow in popularity in the future.
In terms of future development, the EPF10K50EFC256-3 is designed to be upgradable, so that it can keep up with the ever-changing technology landscape. It is also designed to be compatible with a wide range of communication protocols, allowing for easy integration into existing systems and networks. Additionally, the EPF10K50EFC256-3 is designed to be highly customizable, allowing for easy customization to meet the specific needs of a particular application.
The product description of the EPF10K50EFC256-3 states that it is a low-power, high-performance FPGA device that is designed to meet the needs of high performance computing and communication applications. It is capable of providing high-speed data transfer and processing capabilities, while consuming minimal power. It is also designed to be upgradable and compatible with a wide range of communication protocols. Additionally, the EPF10K50EFC256-3 is highly customizable, allowing for easy customization to meet the specific needs of a particular application.
In terms of actual case studies, the EPF10K50EFC256-3 has been used in a variety of applications, such as in medical imaging systems, industrial automation systems, and wireless communication systems. In each case, the EPF10K50EFC256-3 was able to provide the necessary performance and power consumption levels required for the application. Additionally, the EPF10K50EFC256-3 was able to be easily integrated into existing systems and networks, allowing for easy customization of the system to meet the specific needs of the application.
When considering the use of the EPF10K50EFC256-3, it is important to keep in mind that it is a highly advanced chip model, and as such, it may be necessary to consult with an experienced engineer or technician to ensure the proper implementation and use of the chip. Additionally, it is important to ensure that the application environment requires the support of new technologies, as the EPF10K50EFC256-3 may not be able to support all applications.
Overall, the EPF10K50EFC256-3 is a highly advanced, low-power, field-programmable gate array (FPGA) device from Intel. It is designed to meet the needs of high performance computing and communication applications, and is capable of providing high-speed data transfer and processing capabilities, while consuming minimal power. It is also upgradable, compatible with a wide range of communication protocols, and highly customizable, allowing for easy customization to meet the specific needs of a particular application. As such, the EPF10K50EFC256-3 is becoming increasingly popular in the industry and is expected to continue to grow in popularity in the future. However, it is important to ensure that the application environment requires the support of new technologies, as the EPF10K50EFC256-3 may not be able to support all applications.
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Pricing (USD)
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