
Altera Corporation
EPF10K30EQI208-1X
EPF10K30EQI208-1X ECAD Model
EPF10K30EQI208-1X Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 8 ns | |
Number of I/O Lines | 147 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 147 I/O | |
Output Function | MIXED | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.3 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | QFP | |
Package Description | FQFP, | |
Pin Count | 208 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
EPF10K30EQI208-1X Datasheet Download
EPF10K30EQI208-1X Overview
The chip model EPF10K30EQI208-1X is a high-performance and reliable programmable logic device (PLD) developed by Altera Corporation. It is widely used in various fields such as communication, industrial control, consumer electronics, and automotive electronics. This chip model is highly integrated, with a low power consumption, and a wide range of features and functions.
This chip model is designed to provide a flexible and cost-effective solution for customers in various industries. Its main features include a high-speed, low-power, and high-density logic design; a large number of programmable logic elements; a wide range of user-defined functions; and a variety of embedded memory blocks. All these features make the chip model EPF10K30EQI208-1X suitable for a variety of applications, such as high-speed signal processing, digital signal processing, and communication systems.
Regarding the industry trends of the chip model EPF10K30EQI208-1X and the future development of related industries, it is expected that the chip model will continue to be widely used in various applications in the future. As the demand for higher performance and more complex functions increases, the chip model will need to be upgraded to support more advanced technologies. For example, the chip model may need to be upgraded to support the latest communication protocols and algorithms, as well as artificial intelligence and machine learning.
The original design intention of the chip model EPF10K30EQI208-1X and the possibility of future upgrades, as well as whether it can be applied to advanced communication systems, will depend on the specific technologies that are needed. With the development of the Internet of Things (IoT) and 5G networks, the chip model EPF10K30EQI208-1X may need to be upgraded to support the latest technologies such as artificial intelligence, machine learning, and edge computing.
The possible future applications of the chip model EPF10K30EQI208-1X in networks and which intelligent scenarios it may be applied to, as well as whether it is possible to be used in the era of fully intelligent systems, are all promising. The chip model can be used in various intelligent scenarios such as smart home, smart city, and industrial automation. It can also be used in autonomous driving and other applications that require high performance and low power consumption. In addition, the chip model EPF10K30EQI208-1X can be used in the era of fully intelligent systems, such as intelligent robots, autonomous vehicles, and smart factories.
In conclusion, the chip model EPF10K30EQI208-1X is a reliable and cost-effective programmable logic device that is widely used in various applications. With the development of the Internet of Things and 5G networks, the chip model may need to be upgraded to support the latest technologies. It is expected to be used in various intelligent scenarios in the future, such as smart home, smart city, and industrial automation, as well as in the era of fully intelligent systems.
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