
Altera Corporation
EPF10K250ABC600-1
EPF10K250ABC600-1 ECAD Model
EPF10K250ABC600-1 Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Propagation Delay | 500 ps | |
Number of Inputs | 470 | |
Number of Outputs | 470 | |
Number of Logic Cells | 12160 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 470 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 470 I/O | |
Additional Feature | 12160 LOGIC ELEMENTS; 1520 LABS | |
Clock Frequency-Max | 80 MHz | |
Output Function | REGISTERED | |
Power Supplies | 2.5/3.3,3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B600 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 600 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA600,35X35,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 1.93 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | BGA, BGA600,35X35,50 | |
Pin Count | 600 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EPF10K250ABC600-1 Datasheet Download
EPF10K250ABC600-1 Overview
The chip model EPF10K250ABC600-1 is a powerful and efficient solution for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is an industry-standard language for programming and designing digital logic circuits. It is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing.
The chip model EPF10K250ABC600-1 can be used in a variety of intelligent scenarios, such as networks, autonomous vehicles, robotics, and artificial intelligence. It is also capable of being used in the era of fully intelligent systems, such as the Internet of Things (IoT) and Industry 4.0. As this chip is designed to be used with HDL language, it can be programmed to perform complex tasks and can be integrated into existing systems.
The product description of the chip model EPF10K250ABC600-1 includes its specifications, such as its operating frequency range, power consumption, memory capacity, and data transfer rate. It also includes the design requirements, such as the required HDL language, the number of ports, and the type of logic circuit used. Actual case studies and precautions should also be taken into account when designing with the chip model EPF10K250ABC600-1.
In conclusion, the chip model EPF10K250ABC600-1 is a powerful and efficient solution for digital signal processing, embedded processing, and image processing. It is suitable for a wide range of applications and can be used in intelligent scenarios, such as networks, autonomous vehicles, robotics, and artificial intelligence. The product description and specific design requirements should be taken into consideration when designing with the chip model EPF10K250ABC600-1, along with actual case studies and precautions.
You May Also Be Interested In
5,486 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |