Altera Corporation
EPF10K200SFI672-2
EPF10K200SFI672-2 ECAD Model
EPF10K200SFI672-2 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 600 ps | |
| Number of Inputs | 470 | |
| Number of Outputs | 470 | |
| Number of Logic Cells | 9984 | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 470 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | |
| Pin Count | 672 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K200SFI672-2 Datasheet Download
EPF10K200SFI672-2 Overview
The chip model EPF10K200SFI672-2 is a powerful new technology that offers a wide range of potential applications in networks and intelligent systems. It is designed with the highest standards of performance and reliability, making it an ideal choice for those looking to build intelligent systems of the future.
This chip model is capable of handling complex tasks and can be used to create intelligent networks and robots. It is capable of running multiple applications simultaneously, making it ideal for both large-scale and small-scale projects. The chip model also has a wide range of features, such as a high-speed processor, advanced memory management, and powerful security features.
In terms of intelligent scenarios, the chip model EPF10K200SFI672-2 can be used to create intelligent robots, such as autonomous vehicles, drones, and robots that can interact with humans. It can also be used to create intelligent networks, such as those used for smart home systems and industrial automation. The chip model is also suitable for use in the development of fully intelligent systems, allowing for greater control and precision than ever before.
In order to use the chip model EPF10K200SFI672-2 effectively, it is important to understand its design requirements and features. It is also important to understand how to program the chip model and the various techniques that can be used to optimize its performance. In addition, those looking to use the chip model should also be aware of any potential pitfalls or problems that may arise.
Case studies and actual applications of the chip model EPF10K200SFI672-2 can be found in a range of industries, including healthcare, automotive, and aerospace. By studying these case studies, users can gain a better understanding of how the chip model can be used to create intelligent systems.
Finally, it is important to note that the chip model EPF10K200SFI672-2 requires a certain level of technical expertise in order to be used effectively. Those looking to use the chip model should have a good understanding of programming languages, such as C++ and Java, as well as experience in designing and building intelligent systems.
In conclusion, the chip model EPF10K200SFI672-2 is a powerful new technology that offers a wide range of potential applications in networks and intelligent systems. It is designed with the highest standards of performance and reliability, making it an ideal choice for those looking to build intelligent systems of the future. With the right knowledge and experience, users can use the chip model to create powerful and intelligent robots and networks.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||