Altera Corporation
EPF10K200SBC356-3N
EPF10K200SBC356-3N ECAD Model
EPF10K200SBC356-3N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 800 ps | |
| Number of I/O Lines | 274 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 274 I/O | |
| Output Function | MIXED | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | LBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 356 |
EPF10K200SBC356-3N Datasheet Download
EPF10K200SBC356-3N Overview
The chip model EPF10K200SBC356-3N is a high-performance, low-cost programmable logic device designed for digital signal processing, embedded processing, image processing, and other applications. It is based on the FPGA technology and is capable of high-speed data processing, making it suitable for a wide range of applications.
The EPF10K200SBC356-3N chip model is designed to be easy to use and programmable with HDL language. It has an array of features and functions, including support for up to 200K logic elements, up to 356 I/O pins, and up to 8 clock sources. It also supports a wide range of memory types, including SRAM, Flash, and DRAM.
The EPF10K200SBC356-3N chip model provides a wide range of design options for users. It is suitable for a variety of applications, such as digital signal processing, embedded processing, image processing, and more. In addition, it supports a variety of programming languages, such as Verilog, VHDL, and SystemVerilog.
The EPF10K200SBC356-3N chip model is a powerful tool for developing and popularizing future intelligent robots. It is capable of high-speed data processing, making it suitable for a wide range of applications. To use this model effectively, technical talents such as software engineers, hardware engineers, and embedded system designers are required. In addition, knowledge of HDL language is necessary to program the chip model.
To ensure successful implementation of the chip model, it is important to consider the design requirements of the application. For example, the number of logic elements, the number of I/O pins, and the type of memory used must be specified. Furthermore, it is important to consider the power consumption and heat dissipation of the chip model.
In conclusion, the chip model EPF10K200SBC356-3N is a powerful tool for developing and popularizing future intelligent robots. It is capable of high-speed data processing, making it suitable for a wide range of applications. To use this model effectively, technical talents such as software engineers, hardware engineers, and embedded system designers are required. In addition, knowledge of HDL language is necessary to program the chip model. Furthermore, it is important to consider the design requirements of the application and the power consumption and heat dissipation of the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||