Altera Corporation
EPF10K200EFC672-1N
EPF10K200EFC672-1N ECAD Model
EPF10K200EFC672-1N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 400 ps | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 470 I/O | |
| Additional Feature | 9984 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K200EFC672-1N Datasheet Download
EPF10K200EFC672-1N Overview
The chip model EPF10K200EFC672-1N is a high-performance FPGA chip designed for digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language (HDL) and is suitable for a wide variety of applications.
The EPF10K200EFC672-1N chip model offers a great deal of flexibility and scalability, allowing for the design of complex systems with a wide range of applications. It is also capable of supporting advanced communication systems. The chip model is designed to be upgradable, allowing for future upgrades and improvements.
The EPF10K200EFC672-1N chip model is well-suited for applications that require high performance and low power consumption. It is also highly reliable and can be used in a wide range of environments. The chip model is a great choice for applications that require advanced communication systems.
The EPF10K200EFC672-1N chip model is designed to be flexible and scalable, allowing for the design of complex systems with a wide range of applications. It is capable of supporting advanced communication systems and is upgradable, allowing for future upgrades and improvements.
The EPF10K200EFC672-1N chip model is an ideal choice for applications that require high performance and low power consumption. It is also highly reliable and can be used in a wide range of environments. The chip model is a great choice for applications that require advanced communication systems.
The EPF10K200EFC672-1N chip model is designed to be flexible and scalable, allowing for the design of complex systems with a wide range of applications. It is capable of supporting advanced communication systems and is upgradable, allowing for future upgrades and improvements.
The EPF10K200EFC672-1N chip model is designed to meet the industry trends of the future, and its upgradability allows for the integration of new technologies and features. This chip model is suitable for applications that require high performance and low power consumption. It is also highly reliable and can be used in a wide range of environments.
The EPF10K200EFC672-1N chip model is an excellent choice for applications that require high performance and low power consumption. It is also highly reliable and can be used in a wide range of environments. The chip model is designed to be flexible and scalable, allowing for the design of complex systems with a wide range of applications. It is capable of supporting advanced communication systems and is upgradable, allowing for future upgrades and improvements. The chip model is designed to meet the industry trends of the future, and its upgradability allows for the integration of new technologies and features.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||