Altera Corporation
EPF10K130EFC672-3N
EPF10K130EFC672-3N ECAD Model
EPF10K130EFC672-3N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 600 ps | |
| Number of I/O Lines | 413 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 413 I/O | |
| Output Function | MIXED | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 672 |
EPF10K130EFC672-3N Datasheet Download
EPF10K130EFC672-3N Overview
The chip model EPF10K130EFC672-3N is a powerful integrated circuit (IC) device that has been widely used in many industries. It is a Field Programmable Gate Array (FPGA) device manufactured by Altera, and it has the ability to be programmed and reprogrammed to meet the specific needs of various applications. It is designed to be highly reliable, cost-effective, and easy to use, making it a popular choice for many industries.
The chip model EPF10K130EFC672-3N is suitable for a wide range of applications, from automotive and aerospace to industrial automation and medical devices. In addition, it can be used for digital signal processing (DSP), communications, and networking. It is also suitable for developing advanced communication systems, as well as for the development and popularization of future intelligent robots.
In terms of industry trends, the chip model EPF10K130EFC672-3N is expected to become even more popular in the future. As new technologies emerge, it is likely that the model will be able to support more advanced applications. For example, it may be possible to use the model to support 5G communication systems, or to develop more advanced robots with greater levels of autonomy.
In order to effectively use the chip model EPF10K130EFC672-3N, certain technical skills are required. For example, a basic understanding of digital circuit design, programming, and signal processing is necessary. In addition, knowledge of FPGA technology and its applications is also important. Finally, familiarity with the specific features of the chip model is essential in order to take full advantage of its capabilities.
Overall, the chip model EPF10K130EFC672-3N is a powerful integrated circuit device that is suitable for a wide range of applications, from automotive and aerospace to industrial automation and medical devices. It is expected to become even more popular in the future, as new technologies emerge, and its use requires certain technical skills. With its many capabilities, the chip model EPF10K130EFC672-3N is well-suited for the development and popularization of future intelligent robots, as well as for advanced communication systems.
You May Also Be Interested In
3,263 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||