Altera Corporation
EPF10K130EBI356-1
EPF10K130EBI356-1 ECAD Model
EPF10K130EBI356-1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 9 ns | |
| Number of Inputs | 274 | |
| Number of Outputs | 274 | |
| Number of Logic Cells | 6656 | |
| Number of I/O Lines | 274 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 274 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Pin Count | 356 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K130EBI356-1 Datasheet Download
EPF10K130EBI356-1 Overview
The chip model EPF10K130EBI356-1 is an ideal choice for digital signal processing, embedded processing, and image processing. Its features include high-performance, high-speed, and low-power consumption, making it a suitable choice for any application that requires these functions. It also requires the use of HDL language, which is a specialized language for modeling, synthesis and verification of digital designs.
The EPF10K130EBI356-1 chip model offers a number of advantages over other models. It is designed with a high-speed and low-power architecture, making it suitable for applications with limited power consumption. It also provides a wide range of programmable logic functions, allowing users to customize their designs to fit their specific needs. Additionally, its high-performance capabilities make it ideal for high-performance applications such as image processing, embedded processing, and digital signal processing.
The demand for the EPF10K130EBI356-1 chip model is expected to increase in the future. As technology continues to evolve, more and more applications will require the use of high-performance and low-power chips. This chip model is well-suited to these applications and will likely become a popular choice.
The EPF10K130EBI356-1 chip model can also be applied to the development and popularization of future intelligent robots. This chip model provides the necessary performance and low-power capabilities, making it a suitable choice for powering intelligent robots. However, using the chip model effectively will require technical expertise, as it requires the use of a specialized HDL language. Those with the necessary skills and knowledge will be able to use this chip model to create powerful, efficient, and low-power robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||