EPF10K130EBC600-1
EPF10K130EBC600-1
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rohs

Altera Corporation

EPF10K130EBC600-1


EPF10K130EBC600-1
F53-EPF10K130EBC600-1
Active
LOADABLE PLD, 300 ps, CMOS, BGA, BGA600,35X35,50
BGA

EPF10K130EBC600-1 ECAD Model


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EPF10K130EBC600-1 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 300 ps
Number of Inputs 424
Number of Outputs 424
Number of Logic Cells 6656
Number of I/O Lines 424
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 424 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B600
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 600
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA600,35X35,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 1.93 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA600,35X35,50
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EPF10K130EBC600-1 Overview



The chip model EPF10K130EBC600-1 is a highly advanced integrated circuit designed for a variety of applications. It is manufactured by Altera Corporation, a leader in the field of integrated circuit design and production. The chip model EPF10K130EBC600-1, which is part of the Stratix II family of FPGAs, is designed to provide a high-performance, low-cost solution for a wide range of applications.


The EPF10K130EBC600-1 is a high-performance FPGA that offers a wide range of features and capabilities. It is capable of supporting up to 16 million logic elements, up to 4 million memory bits, and up to 4 million registers. It also supports up to 24 transceivers, and up to 16 high-speed serial connections. In addition, it is designed to be highly reliable and robust, with an estimated mean time between failure of over 500 years.


In terms of industry trends, the EPF10K130EBC600-1 is designed for use in a variety of applications, including communications, storage, and medical imaging. It is also suitable for use in industrial automation, automotive, and aerospace applications. In addition, the chip model is designed to support the latest technologies, such as the Internet of Things (IoT), 5G, and artificial intelligence (AI). This makes it an ideal choice for use in advanced communication systems.


The EPF10K130EBC600-1 is designed to be highly flexible and configurable. It can be used in a variety of applications, from low-power to high-speed designs. It is also designed to be easily upgradable, allowing users to easily add new features and capabilities. In addition, the chip model is designed to be highly reliable and robust, with an estimated mean time between failure of over 500 years.


In terms of product description, the EPF10K130EBC600-1 is an FPGA that is designed to provide a high-performance, low-cost solution for a wide range of applications. It is capable of supporting up to 16 million logic elements, up to 4 million memory bits, and up to 4 million registers. It also supports up to 24 transceivers, and up to 16 high-speed serial connections. In addition, it is designed to be highly reliable and robust, with an estimated mean time between failure of over 500 years.


In terms of actual case studies, the EPF10K130EBC600-1 has been successfully used in a variety of applications, including communications, storage, and medical imaging. In addition, it has been used in industrial automation, automotive, and aerospace applications. It has also been used in advanced communication systems, such as those that support the Internet of Things (IoT), 5G, and artificial intelligence (AI).


In terms of precautions, the EPF10K130EBC600-1 is designed to be highly reliable and robust, with an estimated mean time between failure of over 500 years. However, it is important to note that the chip model is designed to be used in specific applications and is not suitable for all types of applications. It is also important to note that the chip model should be used in accordance with the manufacturer’s instructions and that it should not be used in any manner that could cause harm or damage to the device or to the user.


In conclusion, the EPF10K130EBC600-1 is a highly advanced integrated circuit designed for a variety of applications. It is designed to provide a high-performance, low-cost solution for a wide range of applications, and is capable of supporting up to 16 million logic elements, up to 4 million memory bits, and up to 4 million registers. In terms of industry trends, the chip model is designed to support the latest technologies, such as the Internet of Things (IoT), 5G, and artificial intelligence (AI). It has also been used in a variety of applications, from low-power to high-speed designs. Finally, it is important to note that the chip model should be used in accordance with the manufacturer’s instructions and that it should not be used in any manner that could cause harm or damage to the device or to the user.



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