
Altera Corporation
EPF10K130EBC600-1
EPF10K130EBC600-1 ECAD Model
EPF10K130EBC600-1 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 300 ps | |
Number of Inputs | 424 | |
Number of Outputs | 424 | |
Number of Logic Cells | 6656 | |
Number of I/O Lines | 424 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 424 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B600 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 600 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA600,35X35,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 1.93 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA600,35X35,50 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
EPF10K130EBC600-1 Overview
The chip model EPF10K130EBC600-1 is a highly advanced integrated circuit designed for a variety of applications. It is manufactured by Altera Corporation, a leader in the field of integrated circuit design and production. The chip model EPF10K130EBC600-1, which is part of the Stratix II family of FPGAs, is designed to provide a high-performance, low-cost solution for a wide range of applications.
The EPF10K130EBC600-1 is a high-performance FPGA that offers a wide range of features and capabilities. It is capable of supporting up to 16 million logic elements, up to 4 million memory bits, and up to 4 million registers. It also supports up to 24 transceivers, and up to 16 high-speed serial connections. In addition, it is designed to be highly reliable and robust, with an estimated mean time between failure of over 500 years.
In terms of industry trends, the EPF10K130EBC600-1 is designed for use in a variety of applications, including communications, storage, and medical imaging. It is also suitable for use in industrial automation, automotive, and aerospace applications. In addition, the chip model is designed to support the latest technologies, such as the Internet of Things (IoT), 5G, and artificial intelligence (AI). This makes it an ideal choice for use in advanced communication systems.
The EPF10K130EBC600-1 is designed to be highly flexible and configurable. It can be used in a variety of applications, from low-power to high-speed designs. It is also designed to be easily upgradable, allowing users to easily add new features and capabilities. In addition, the chip model is designed to be highly reliable and robust, with an estimated mean time between failure of over 500 years.
In terms of product description, the EPF10K130EBC600-1 is an FPGA that is designed to provide a high-performance, low-cost solution for a wide range of applications. It is capable of supporting up to 16 million logic elements, up to 4 million memory bits, and up to 4 million registers. It also supports up to 24 transceivers, and up to 16 high-speed serial connections. In addition, it is designed to be highly reliable and robust, with an estimated mean time between failure of over 500 years.
In terms of actual case studies, the EPF10K130EBC600-1 has been successfully used in a variety of applications, including communications, storage, and medical imaging. In addition, it has been used in industrial automation, automotive, and aerospace applications. It has also been used in advanced communication systems, such as those that support the Internet of Things (IoT), 5G, and artificial intelligence (AI).
In terms of precautions, the EPF10K130EBC600-1 is designed to be highly reliable and robust, with an estimated mean time between failure of over 500 years. However, it is important to note that the chip model is designed to be used in specific applications and is not suitable for all types of applications. It is also important to note that the chip model should be used in accordance with the manufacturer’s instructions and that it should not be used in any manner that could cause harm or damage to the device or to the user.
In conclusion, the EPF10K130EBC600-1 is a highly advanced integrated circuit designed for a variety of applications. It is designed to provide a high-performance, low-cost solution for a wide range of applications, and is capable of supporting up to 16 million logic elements, up to 4 million memory bits, and up to 4 million registers. In terms of industry trends, the chip model is designed to support the latest technologies, such as the Internet of Things (IoT), 5G, and artificial intelligence (AI). It has also been used in a variety of applications, from low-power to high-speed designs. Finally, it is important to note that the chip model should be used in accordance with the manufacturer’s instructions and that it should not be used in any manner that could cause harm or damage to the device or to the user.
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