Altera Corporation
EPF10K100BFC256-3
EPF10K100BFC256-3 ECAD Model
EPF10K100BFC256-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 14.5 ns | |
| Number of Inputs | 191 | |
| Number of Outputs | 191 | |
| Number of Logic Cells | 4992 | |
| Number of I/O Lines | 191 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 191 I/O | |
| Additional Feature | 4992 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EPF10K100BFC256-3 Datasheet Download
EPF10K100BFC256-3 Overview
The chip model EPF10K100BFC256-3 is a powerful, high-performance chip designed for digital signal processing, embedded processing, image processing, and other applications. It is designed to use HDL (Hardware Description Language) to program and configure the chip. This makes it an ideal choice for engineers and developers looking to build applications that require a high level of performance.
The EPF10K100BFC256-3 is part of a larger trend in the chip industry towards more powerful and versatile chips. As the industry continues to develop and new technologies are introduced, the EPF10K100BFC256-3 will continue to evolve and grow. This chip is already well-suited for high-end applications such as advanced communication systems, but it has the potential to be upgraded to support even more advanced technologies in the future.
The original design intention of the EPF10K100BFC256-3 was to provide a powerful and efficient chip for digital signal processing, embedded processing, and image processing. The chip was designed with the latest technologies in mind, and it is capable of being upgraded to support newer technologies as they are developed. This makes the EPF10K100BFC256-3 a great choice for developers who need a high-performance chip that is capable of handling the latest applications.
In conclusion, the chip model EPF10K100BFC256-3 is an excellent choice for developers looking to build applications that require a high level of performance. Its original design intention was to provide a powerful and efficient chip for digital signal processing, embedded processing, and image processing. It is capable of being upgraded to support new technologies as they are developed, making it an ideal choice for advanced communication systems. As the chip industry continues to develop, the EPF10K100BFC256-3 will remain a powerful and versatile chip that is capable of handling the latest applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||