Altera Corporation
EP900LC
EP900LC ECAD Model
EP900LC Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 60 ns | |
| Number of Inputs | 36 | |
| Number of Outputs | 24 | |
| Number of Dedicated Inputs | 12 | |
| Number of I/O Lines | 24 | |
| Programmable Logic Type | OT PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 12 DEDICATED INPUTS, 24 I/O | |
| Additional Feature | 24 MACROCELLS | |
| Architecture | PAL-TYPE | |
| Clock Frequency-Max | 20 MHz | |
| Number of Product Terms | 240 | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 44 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC44,.7SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 16.6116 mm | |
| Length | 16.6116 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | LCC | |
| Package Description | QCCJ, LDCC44,.7SQ | |
| Pin Count | 44 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EP900LC Datasheet Download
EP900LC Overview
The chip model EP900LC has been designed to meet the ever-growing demands of the telecommunications industry. It is a high-performance, low-power, low-cost solution that can be used in a variety of applications. The EP900LC is designed to be a flexible and reliable solution for both existing and emerging communications systems.
The EP900LC chip model offers a number of advantages. It is designed to be highly reliable and efficient, with a low power consumption and a low cost. It is also designed to be highly flexible, allowing for upgrades and modifications to be made as needed. This makes it ideal for use in a wide range of applications, from basic communication systems to more advanced networks.
The EP900LC chip model is also designed to be able to be used in the era of fully intelligent systems. This means that it can be used in a variety of intelligent scenarios, such as autonomous driving, smart homes, and more. It is also designed to be able to be used in networks, allowing for more efficient communication and data transfer.
The EP900LC chip model is expected to be in high demand in the coming years. As more and more applications are developed that require the use of intelligent systems, the demand for the EP900LC chip model will likely increase. This will ensure that the chip model remains a reliable and efficient solution for the telecommunications industry.
The EP900LC chip model is designed to be a reliable and efficient solution for the telecommunications industry. It offers a number of advantages, such as low power consumption, low cost, and flexibility. It is also designed to be able to be used in the era of fully intelligent systems, making it ideal for use in a variety of applications. The EP900LC chip model is expected to be in high demand in the coming years, as more and more applications are developed that require the use of intelligent systems.
