
Altera Corporation
EP900DM
EP900DM ECAD Model
EP900DM Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 60 ns | |
Number of Inputs | 36 | |
Number of Outputs | 24 | |
Number of Dedicated Inputs | 12 | |
Number of I/O Lines | 24 | |
Programmable Logic Type | UV PLD | |
Temperature Grade | MILITARY | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 12 DEDICATED INPUTS, 24 I/O | |
Additional Feature | 24 MACROCELLS | |
Architecture | PAL-TYPE | |
Clock Frequency-Max | 20 MHz | |
Number of Product Terms | 240 | |
Output Function | MACROCELL | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | R-GDIP-T40 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 40 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP40,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Surface Mount | NO | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm | |
Length | 52.07 mm | |
Seated Height-Max | 5.715 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | DIP | |
Package Description | WDIP, DIP40,.6 | |
Pin Count | 40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.2.C |
EP900DM Datasheet Download
EP900DM Overview
The EP900DM chip model is a revolutionary product that offers unparalleled performance and reliability for a wide range of applications. Developed by the leading chip manufacturer, EP900DM offers superior performance and reliability for networks, intelligent systems, and other related industries. This chip model is designed to meet the most stringent requirements and is capable of providing high-speed data processing and storage, while also providing a stable and reliable connection.
The EP900DM chip model has a number of advantages over its competitors. It is designed to be highly reliable, with a low failure rate and a high level of performance. The chip model is also designed to be highly power efficient, allowing for a wide range of applications without sacrificing performance. Furthermore, the chip model is designed to be highly secure, with a number of security features that make it difficult for malicious actors to gain access to the chip’s data.
The EP900DM chip model is expected to be in high demand in the future, as it is well suited for a wide range of applications. The chip model is well suited for use in networks and intelligent scenarios, as it is capable of providing a high level of performance and reliability while also being highly secure. Furthermore, the chip model is well suited for use in the era of fully intelligent systems, as its design is capable of providing the necessary performance and security for such systems.
The product description and specific design requirements of the EP900DM chip model are as follows. The chip model is designed to be highly reliable, with a low failure rate and a high level of performance. The chip model is also designed to be highly power efficient, allowing for a wide range of applications without sacrificing performance. Furthermore, the chip model is designed to be highly secure, with a number of security features that make it difficult for malicious actors to gain access to the chip’s data.
To demonstrate the performance of the EP900DM chip model, a number of case studies have been conducted. These case studies have shown that the chip model is capable of providing a high level of performance and reliability while also being highly secure. Furthermore, the chip model has been tested in a number of different scenarios, including networks and intelligent systems, and has been found to be highly reliable in these scenarios.
When using the EP900DM chip model, it is important to take a number of precautions. It is important to ensure that the chip model is installed and configured properly, as improper installation or configuration could lead to a decrease in performance or security. Furthermore, it is important to ensure that the chip model is regularly updated with the latest security patches, as this will help ensure that the chip model remains secure. Finally, it is important to ensure that the chip model is regularly monitored, as this will help identify any potential issues before they become serious.
You May Also Be Interested In
4,429 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $112.1179 | $112.1179 |
10+ | $110.9123 | $1,109.1235 |
100+ | $104.8845 | $10,488.4503 |
1000+ | $98.8567 | $49,428.3290 |
10000+ | $90.4177 | $90,417.6750 |
The price is for reference only, please refer to the actual quotation! |