Altera Corporation
EP900DI
EP900DI ECAD Model
EP900DI Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 60 ns | |
| Number of Inputs | 36 | |
| Number of Outputs | 24 | |
| Number of Dedicated Inputs | 12 | |
| Number of I/O Lines | 24 | |
| Programmable Logic Type | UV PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 12 DEDICATED INPUTS, 24 I/O | |
| Additional Feature | 24 MACROCELLS | |
| Architecture | PAL-TYPE | |
| Clock Frequency-Max | 20 MHz | |
| Number of Product Terms | 240 | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-GDIP-T40 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 40 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP40,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm | |
| Length | 52.07 mm | |
| Seated Height-Max | 5.715 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP40,.6 | |
| Pin Count | 40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP900DI Datasheet Download
EP900DI Overview
The chip model EP900DI is a powerful and advanced microprocessor that has revolutionized the chip industry. It has been developed to meet the needs of the ever-evolving industry and is capable of providing superior performance and reliability. This chip model is the latest in a series of advanced microprocessors that have been released by the company, and it has been designed to meet the needs of modern applications in the areas of consumer electronics, automotive, and industrial applications.
The EP900DI is a highly efficient and powerful chip model that has been designed to provide superior performance and reliability. It features a wide range of features, including a high-speed processor, a powerful graphics processor, and a wide range of memory options. This chip model is also capable of supporting a variety of operating systems and applications, making it an ideal choice for many applications.
The EP900DI is also capable of providing a wide range of intelligent scenarios and applications, including the ability to support fully intelligent systems. This chip model is capable of providing support for a range of intelligent scenarios, such as artificial intelligence, machine learning, and natural language processing. This chip model is also capable of providing support for a range of networks, including the Internet of Things (IoT) and 5G networks.
The EP900DI is expected to be in high demand in the future, as the chip industry continues to evolve and new technologies are developed. This chip model is expected to be used in a variety of applications, including in the automotive, consumer electronics, and industrial sectors. This chip model is also expected to be used in a variety of intelligent scenarios, such as in the development of fully intelligent systems.
In conclusion, the EP900DI chip model is a powerful and advanced microprocessor that is capable of providing superior performance and reliability. This chip model is expected to be in high demand in the future, as the chip industry continues to evolve and new technologies are developed. This chip model is capable of providing support for a range of intelligent scenarios, such as artificial intelligence, machine learning, and natural language processing, as well as providing support for a range of networks, including the Internet of Things (IoT) and 5G networks.
