Altera Corporation
EP600DM883B
EP600DM883B ECAD Model
EP600DM883B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 55 ns | |
| Number of Inputs | 20 | |
| Number of Outputs | 16 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 16 | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 16 I/O | |
| Additional Feature | 16 MACROCELLS | |
| Architecture | PAL-TYPE | |
| Clock Frequency-Max | 23.3 MHz | |
| Number of Product Terms | 160 | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-CDIP-T24 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 24 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | DIP, DIP24,.3 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
EP600DM883B Datasheet Download
EP600DM883B Overview
The chip model EP600DM883B is a product of the semiconductor industry and is widely used in many applications. It has been a popular choice for many users due to its high performance, low power consumption and cost-effectiveness. With the rapid development of the Internet of Things, artificial intelligence and other related technologies, the chip model EP600DM883B has become an important part of the industry and its future development.
As the chip model EP600DM883B is widely used in the industry, it is important to consider the industry trends and the future development of related industries. It is necessary to consider what specific technologies are needed to support the application environment. For example, the chip model EP600DM883B could be used in networks and intelligent scenarios, such as smart homes, smart cities and intelligent robots. In the era of fully intelligent systems, the chip model EP600DM883B could be used to develop and popularize future intelligent robots.
In order to use the chip model EP600DM883B effectively, it is important to have technical talents who are familiar with the model. They should have knowledge of the chip model EP600DM883B, its applications, and the latest technologies in the industry. They should also be able to identify the needs of the application environment and develop solutions for them.
In conclusion, the chip model EP600DM883B is an important part of the semiconductor industry and its future development. It is necessary to consider the industry trends, the future development of related industries, and the specific technologies that are needed to support the application environment. The chip model EP600DM883B could be used in networks and intelligent scenarios, and it is possible to be used in the era of fully intelligent systems. Technical talents are needed to use the chip model EP600DM883B effectively and develop solutions for the application environment.
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3,293 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $102.6670 | $102.6670 |
| 10+ | $101.5630 | $1,015.6303 |
| 100+ | $96.0433 | $9,604.3302 |
| 1000+ | $90.5236 | $45,261.7860 |
| 10000+ | $82.7960 | $82,795.9500 |
| The price is for reference only, please refer to the actual quotation! | ||