EP4SGX530HH35I2N
EP4SGX530HH35I2N
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rohs

Altera Corporation

EP4SGX530HH35I2N


EP4SGX530HH35I2N
F53-EP4SGX530HH35I2N
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA
BGA

EP4SGX530HH35I2N ECAD Model


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EP4SGX530HH35I2N Attributes


Type Description Select
Part Life Cycle Code Transferred
Number of CLBs 212480
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 212480 CLBS
JESD-30 Code S-PBGA-B1152
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.7 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description BGA,
Pin Count 1152
Reach Compliance Code unknown
HTS Code 8542.39.00.01

EP4SGX530HH35I2N Datasheet Download


EP4SGX530HH35I2N Overview



The chip model EP4SGX530HH35I2N is a high-performance digital signal processing system-on-chip (SoC) designed for embedded processing and image processing applications. It is the most advanced and powerful SoC of its kind and is capable of meeting the needs of a wide variety of applications. It is designed to be used with HDL (hardware description language) and is capable of delivering superior performance and reliability.


The EP4SGX530HH35I2N is designed to provide the highest levels of performance, reliability, and scalability. It has a powerful processor core that is capable of supporting multiple high-speed interfaces, including USB, Ethernet, and Serial ATA. It also includes an embedded memory controller that allows for fast and efficient access to memory. The EP4SGX530HH35I2N also includes an integrated graphics processor that can be used for 3D graphics and video processing.


The EP4SGX530HH35I2N offers several advantages over other SoCs. It is designed to reduce the total cost of ownership by providing a high-performance solution at a lower cost. It also offers a high degree of scalability, allowing users to easily scale their system as their needs change. Additionally, it is designed to be highly reliable, making it a great choice for mission-critical applications.


The EP4SGX530HH35I2N is expected to be in high demand in the future as more applications require high-performance digital signal processing and embedded processing. The chip model is already being used in a variety of industries, including medical, automotive, and aerospace, and its use is expected to continue to grow.


When designing a system with the EP4SGX530HH35I2N, designers should be aware of the chip's capabilities and limitations. It is important to consider the power requirements of the chip, as well as the design requirements for the system as a whole. Additionally, designers should be aware of the chip's memory requirements, as well as its operating temperature range. It is also important to consider the chip's compatibility with other components in the system, such as memory and I/O devices.


Designers should also be aware of the safety and reliability considerations when using the EP4SGX530HH35I2N. It is important to ensure that the chip is properly cooled and that the system is designed to meet the necessary safety standards. Additionally, it is important to ensure that the chip is designed to meet the necessary reliability requirements.


Case studies of successful designs using the EP4SGX530HH35I2N can provide valuable insights into the chip's capabilities and limitations. Additionally, designers should be aware of the available design tools and software that can help them create a successful design. This can include software for debugging, testing, and simulation, as well as tools for creating and verifying HDL code.


The EP4SGX530HH35I2N is a powerful and reliable SoC that is capable of meeting the needs of a wide variety of applications. With its high-performance processor core, embedded memory controller, and integrated graphics processor, it is an ideal choice for high-performance digital signal processing, embedded processing, and image processing applications. By understanding the chip's capabilities and limitations, designers can create a successful design that meets their requirements and provides superior performance and reliability.



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