Altera Corporation
EP4SGX230DF29C4NES
EP4SGX230DF29C4NES ECAD Model
EP4SGX230DF29C4NES Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of CLBs | 9120 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 9120 CLBS | |
| Clock Frequency-Max | 717 MHz | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, LEAD FREE, FBGA-780 | |
| Pin Count | 780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP4SGX230DF29C4NES Datasheet Download
EP4SGX230DF29C4NES Overview
The chip model EP4SGX230DF29C4NES is a high-performance, low-cost FPGA solution for a wide range of applications. It is designed to meet the needs of today's demanding applications, including communications, embedded systems, data processing, and storage. The chip model offers a number of advantages, including a low power consumption, high speed, and a wide range of features.
The EP4SGX230DF29C4NES chip model is designed to meet the needs of today's most demanding applications. It is equipped with a high-speed, low-power FPGA solution that enables it to deliver high performance and low cost. It also supports a wide range of features, such as high-speed memory access, high-speed data transfer, and high-speed signal processing. The chip model also offers a wide range of I/O ports, allowing for the connection of multiple devices.
The EP4SGX230DF29C4NES chip model is designed to meet the needs of the most advanced communications systems. It is equipped with a high-speed, low-power FPGA solution that enables it to deliver high performance and low cost. It also supports a wide range of features, such as high-speed memory access, high-speed data transfer, and high-speed signal processing. The chip model also offers a wide range of I/O ports, allowing for the connection of multiple devices.
The EP4SGX230DF29C4NES chip model is designed to meet the needs of today's most advanced communications systems. It is equipped with a high-speed, low-power FPGA solution that enables it to deliver high performance and low cost. It also supports a wide range of features, such as high-speed memory access, high-speed data transfer, and high-speed signal processing. The chip model also offers a wide range of I/O ports, allowing for the connection of multiple devices.
The EP4SGX230DF29C4NES chip model is designed to meet the needs of today's most advanced communications systems. It is equipped with a high-speed, low-power FPGA solution that enables it to deliver high performance and low cost. It also supports a wide range of features, such as high-speed memory access, high-speed data transfer, and high-speed signal processing. The chip model also offers a wide range of I/O ports, allowing for the connection of multiple devices.
The EP4SGX230DF29C4NES chip model is designed to meet the needs of today's most advanced communications systems. It is equipped with a high-speed, low-power FPGA solution that enables it to deliver high performance and low cost. It also supports a wide range of features, such as high-speed memory access, high-speed data transfer, and high-speed signal processing. The chip model also offers a wide range of I/O ports, allowing for the connection of multiple devices.
The EP4SGX230DF29C4NES chip model is designed with the intention of providing users with a reliable, cost-effective, and high-performance solution for their communications needs. This model is expected to become increasingly popular in the coming years, as more companies look to take advantage of its features and benefits. It is also expected to be used in a variety of applications, including embedded systems, data processing, and storage.
The design requirements of the EP4SGX230DF29C4NES chip model are designed to meet the needs of today's most advanced communications systems. It is designed to provide users with a reliable, cost-effective, and high-performance solution for their communications needs. The chip model is also designed to be upgradable, allowing users to take advantage of the latest technology and features. Additionally, the chip model is designed to be compatible with advanced communication systems, allowing for the connection of multiple devices.
When considering the EP4SGX230DF29C4NES chip model, it is important to understand the design requirements and features. Additionally, it is important to consider actual case studies when considering the model, as this can provide valuable insight into the potential benefits and drawbacks of the chip model. Additionally, it is important to consider any potential risks or precautions when using the chip model, as this can help to ensure the safety and security of the system.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||