EP4SE530H35C2NES
EP4SE530H35C2NES
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rohs

Altera Corporation

EP4SE530H35C2NES


EP4SE530H35C2NES
F53-EP4SE530H35C2NES
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA
BGA

EP4SE530H35C2NES ECAD Model


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EP4SE530H35C2NES Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Number of CLBs 21248
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 21248 CLBS
Clock Frequency-Max 800 MHz
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B
Qualification Status Not Qualified
JESD-609 Code e1
Operating Temperature-Max 85 °C
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.7 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description BGA,
Pin Count 1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP4SE530H35C2NES Datasheet Download


EP4SE530H35C2NES Overview



The chip model EP4SE530H35C2NES is a revolutionary product that has been developed to address the ever-increasing demand for advanced semiconductor technology. It is a high-performance, low-power, low-cost, and highly reliable chip model that is ideal for a wide range of applications. This chip model is designed to provide a high degree of flexibility and scalability that can be used for a variety of applications.


The EP4SE530H35C2NES chip model has a number of advantages that make it an attractive option for many industries. It is capable of delivering high-speed data processing speeds and low-power consumption. Additionally, it features a wide range of features including high-speed signal processing, multiple clock sources, and an extended range of frequency options. This chip model also has an integrated memory controller and a high-speed I/O interface.


The EP4SE530H35C2NES chip model is expected to see increased demand in the coming years, particularly in the areas of communication, networking, and embedded systems. This chip model is well-suited for use in a variety of applications, including wireless communication systems, data acquisition systems, and industrial automation systems. Additionally, this chip model can be used to develop and popularize future intelligent robots, as it offers a high degree of scalability and flexibility.


The EP4SE530H35C2NES chip model was designed with a view to potential future upgrades. It is capable of being upgraded to support new technologies, such as 5G networks, as well as being capable of being used in advanced communication systems. This chip model is also capable of being used in the development and popularization of future intelligent robots, as it offers a high degree of scalability and flexibility.


In order to use the EP4SE530H35C2NES chip model effectively, it is necessary to have a good understanding of the underlying technology and the associated skills. This chip model requires a good knowledge of semiconductor technology, as well as the ability to use a wide range of software and hardware tools. Additionally, it is necessary to have a good understanding of the hardware and software design process, as well as the ability to develop and debug complex systems.


The EP4SE530H35C2NES chip model is a revolutionary product that offers a wide range of features and benefits. It is expected to see increased demand in the coming years, particularly in the areas of communication, networking, and embedded systems. This chip model is capable of being upgraded to support new technologies, such as 5G networks, and is capable of being used in the development and popularization of future intelligent robots. In order to use the EP4SE530H35C2NES chip model effectively, it is necessary to have a good understanding of the underlying technology and the associated skills.



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