Altera Corporation
EP3SL70F484I2N
EP3SL70F484I2N ECAD Model
EP3SL70F484I2N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Number of Inputs | 296 | |
| Number of Outputs | 296 | |
| Number of Logic Cells | 67500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 1.2/3.3 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL70F484I2N Datasheet Download
EP3SL70F484I2N Overview
The EP3SL70F484I2N is a state-of-the-art chip model that is suitable for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the HDL language and is capable of meeting the needs of various industries. As such, it is a great choice for those looking for a powerful and reliable chip model.
The EP3SL70F484I2N is a powerful chip model that is capable of handling a variety of tasks. It is designed to be used in applications that require high-performance digital signal processing, embedded processing, and image processing. It is also capable of handling complex tasks, such as artificial intelligence and machine learning.
The EP3SL70F484I2N is designed to be programmed using the HDL language. This language is designed to be easy to learn and use, making it ideal for those who are new to programming. The language also allows for a high degree of flexibility and customization, making it a great choice for those who need to customize their code to meet their specific needs.
The EP3SL70F484I2N is designed to be used in a variety of industries. It is capable of handling tasks in areas such as automotive, medical, consumer electronics, and industrial automation. It is also capable of handling complex tasks, such as artificial intelligence and machine learning. This makes it a great choice for those who need a powerful and reliable chip model for their applications.
When it comes to industry trends and the future development of related industries, it is important to understand what specific technologies are needed. The EP3SL70F484I2N is designed to be used in a variety of industries, and the specific design requirements and product descriptions of the chip model will vary depending on the industry. It is important to understand the specific requirements and design considerations for each industry, as well as any new technologies that may be needed in order to ensure the chip model is successful.
In addition to understanding the specific requirements of the chip model and the industry, it is also important to consider any actual case studies or precautions that may be needed. It is important to understand any potential risks or issues that may arise when using the chip model, as well as any potential solutions. This will help ensure the chip model is successful and reliable in the application environment.
Overall, the EP3SL70F484I2N is a powerful and reliable chip model that is suitable for a variety of industries. It is designed to be programmed using the HDL language and is capable of handling a variety of tasks. It is important to understand the specific requirements and design considerations for each industry, as well as any new technologies that may be needed in order to ensure the chip model is successful. Additionally, it is important to consider any actual case studies or precautions that may be needed in order to ensure the chip model is successful and reliable in the application environment.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
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| No reference price found. | ||