EP3SL50F780I2
EP3SL50F780I2
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rohs

Altera Corporation

EP3SL50F780I2


EP3SL50F780I2
F53-EP3SL50F780I2
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA780,28X28,40
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EP3SL50F780I2 ECAD Model


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EP3SL50F780I2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Contact Manufacturer
Number of Inputs 488
Number of Outputs 488
Number of Logic Cells 47500
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 100 MHz
Power Supplies 1.2/3.3 V
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Number of Terminals 780
Package Body Material PLASTIC
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL50F780I2 Overview



The chip model EP3SL50F780I2 is a highly advanced and powerful chip designed for high-performance digital signal processing, embedded processing, and image processing. It is designed with the HDL language and is suitable for a variety of applications.


As the technology needed for the application environment of the chip model EP3SL50F780I2 is constantly changing, the industry trends and the future development of related industries are always changing as well. New technologies are needed to be supported in order to keep up with these industry trends and to ensure that the chip model EP3SL50F780I2 is able to perform at its best.


The original design intention of the chip model EP3SL50F780I2 was to provide users with a powerful and reliable tool for their digital signal processing, embedded processing, and image processing needs. The chip model EP3SL50F780I2 is also capable of being upgraded in the future and can be applied to advanced communication systems. This chip model is highly versatile and can be used in a variety of different applications.


The chip model EP3SL50F780I2 is a powerful and reliable tool for digital signal processing, embedded processing, and image processing. It is designed with the HDL language and is suitable for a variety of applications. By keeping up with industry trends and supporting new technologies, the chip model EP3SL50F780I2 is able to perform at its best and can be applied to advanced communication systems. This chip model is highly versatile and can be used in a variety of different applications.



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