
Altera Corporation
EP3SL200H780I2N
EP3SL200H780I2N ECAD Model
EP3SL200H780I2N Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Number of Inputs | 488 | |
Number of Outputs | 488 | |
Number of Logic Cells | 200000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 100 MHz | |
Power Supplies | 1.2/3.3 V | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, BGA780,28X28,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL200H780I2N Datasheet Download
EP3SL200H780I2N Overview
The chip model EP3SL200H780I2N is a powerful and versatile model that can be used in many industries. It is designed to meet the needs of a wide range of applications, including data processing, communication, and storage. It is a multi-core processor with high-speed performance and advanced features. The EP3SL200H780I2N is designed to provide a high level of performance while still being cost-effective.
The EP3SL200H780I2N chip model has many advantages. It is capable of running multiple applications simultaneously, providing high speed and low energy consumption. It is also designed to have a low-power consumption rate, making it suitable for various applications. Additionally, the chip model is also capable of supporting a variety of communication protocols, making it suitable for a wide range of applications.
The EP3SL200H780I2N chip model is expected to be in high demand in the near future. As technology continues to advance, the need for more powerful and efficient processors will continue to grow. The EP3SL200H780I2N chip model is designed to meet the needs of these applications, providing a high level of performance and efficiency. Additionally, the chip model is also capable of supporting a variety of communication protocols, making it suitable for a wide range of applications.
The original design intention of the EP3SL200H780I2N chip model is to provide a high level of performance while still being cost-effective. The chip model is capable of supporting a variety of communication protocols, making it suitable for a wide range of applications. Additionally, the chip model is also capable of supporting a variety of advanced communication systems, making it suitable for applications that require the support of new technologies.
The EP3SL200H780I2N chip model is designed to be upgradeable, allowing it to remain up to date with the latest technology. This makes it a great choice for applications that require the support of new technologies. Additionally, the chip model is also capable of supporting a variety of advanced communication systems, making it suitable for applications that require the support of new technologies.
In conclusion, the EP3SL200H780I2N chip model is a powerful and versatile model that can be used in many industries. It is designed to meet the needs of a wide range of applications, including data processing, communication, and storage. It is a multi-core processor with high-speed performance and advanced features. Additionally, the chip model is also capable of supporting a variety of communication protocols, making it suitable for a wide range of applications. The EP3SL200H780I2N chip model is expected to be in high demand in the near future, and it is designed to be upgradeable, allowing it to remain up to date with the latest technology. This makes it a great choice for applications that require the support of new technologies.
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