EP3SL200H780I2N
EP3SL200H780I2N
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rohs

Altera Corporation

EP3SL200H780I2N


EP3SL200H780I2N
F53-EP3SL200H780I2N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA780,28X28,40
BGA, BGA780,28X28,40

EP3SL200H780I2N ECAD Model


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EP3SL200H780I2N Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Number of Inputs 488
Number of Outputs 488
Number of Logic Cells 200000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 100 MHz
Power Supplies 1.2/3.3 V
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
JESD-609 Code e1
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL200H780I2N Datasheet Download


EP3SL200H780I2N Overview



The chip model EP3SL200H780I2N is a powerful and versatile model that can be used in many industries. It is designed to meet the needs of a wide range of applications, including data processing, communication, and storage. It is a multi-core processor with high-speed performance and advanced features. The EP3SL200H780I2N is designed to provide a high level of performance while still being cost-effective.


The EP3SL200H780I2N chip model has many advantages. It is capable of running multiple applications simultaneously, providing high speed and low energy consumption. It is also designed to have a low-power consumption rate, making it suitable for various applications. Additionally, the chip model is also capable of supporting a variety of communication protocols, making it suitable for a wide range of applications.


The EP3SL200H780I2N chip model is expected to be in high demand in the near future. As technology continues to advance, the need for more powerful and efficient processors will continue to grow. The EP3SL200H780I2N chip model is designed to meet the needs of these applications, providing a high level of performance and efficiency. Additionally, the chip model is also capable of supporting a variety of communication protocols, making it suitable for a wide range of applications.


The original design intention of the EP3SL200H780I2N chip model is to provide a high level of performance while still being cost-effective. The chip model is capable of supporting a variety of communication protocols, making it suitable for a wide range of applications. Additionally, the chip model is also capable of supporting a variety of advanced communication systems, making it suitable for applications that require the support of new technologies.


The EP3SL200H780I2N chip model is designed to be upgradeable, allowing it to remain up to date with the latest technology. This makes it a great choice for applications that require the support of new technologies. Additionally, the chip model is also capable of supporting a variety of advanced communication systems, making it suitable for applications that require the support of new technologies.


In conclusion, the EP3SL200H780I2N chip model is a powerful and versatile model that can be used in many industries. It is designed to meet the needs of a wide range of applications, including data processing, communication, and storage. It is a multi-core processor with high-speed performance and advanced features. Additionally, the chip model is also capable of supporting a variety of communication protocols, making it suitable for a wide range of applications. The EP3SL200H780I2N chip model is expected to be in high demand in the near future, and it is designed to be upgradeable, allowing it to remain up to date with the latest technology. This makes it a great choice for applications that require the support of new technologies.



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