EP3SE260F780I2N
EP3SE260F780I2N
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Altera Corporation

EP3SE260F780I2N


EP3SE260F780I2N
F53-EP3SE260F780I2N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA780,28X28,40
BGA, BGA780,28X28,40

EP3SE260F780I2N ECAD Model


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EP3SE260F780I2N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Number of Inputs 488
Number of Outputs 480
Number of Logic Cells 255000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 100 MHz
Power Supplies 1.2/3.3 V
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
JESD-609 Code e1
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE260F780I2N Datasheet Download


EP3SE260F780I2N Overview



The chip model EP3SE260F780I2N is an important component of the semiconductor industry, and its development and application have been closely watched. In order to better understand the industry trends of the chip model EP3SE260F780I2N and the future development of related industries, it is necessary to consider what specific technologies are needed.


The EP3SE260F780I2N chip model is a high-performance model designed to meet the ever-increasing demands of the industry. It has a wide range of applications in networks, providing a reliable and easy-to-use solution for users. In the future, it is likely to be applied to more intelligent scenarios, such as intelligent robots, and become a key component in the era of fully intelligent systems.


In order to use the EP3SE260F780I2N chip model effectively, it is necessary to have certain technical talents. This includes a deep understanding of the chip model itself, as well as the ability to use it in various applications. In addition, the chip model requires the support of new technologies such as artificial intelligence and machine learning to better meet the needs of the industry.


The development of the EP3SE260F780I2N chip model will have a great impact on the industry, and its application will bring more convenience and efficiency to users. With the right technical talents and the support of new technologies, the chip model will become an important part of the future intelligent system. In the future, it is likely to be used in more intelligent scenarios and become a key component in the development and popularization of future intelligent robots.



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