Altera Corporation
EP3SE260F1517I2N
EP3SE260F1517I2N ECAD Model
EP3SE260F1517I2N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Number of Inputs | 976 | |
| Number of Outputs | 976 | |
| Number of Logic Cells | 255000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 1.2/3.3 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1517I2N Datasheet Download
EP3SE260F1517I2N Overview
The chip model EP3SE260F1517I2N is a highly advanced integrated circuit that has been developed to meet the ever-increasing demands of the modern world. This chip model is designed to provide a robust and reliable platform for various applications, ranging from communications and networking to industrial automation. It is capable of providing high-speed data transmission, low-power operation, and a wide range of features.
The EP3SE260F1517I2N is designed to be used in a wide variety of applications and environments. It is designed to be used in both wired and wireless networks, as well as in industrial automation systems. It is also capable of being used in highly intelligent scenarios, such as smart home, smart city, and autonomous driving. This chip model is also designed to be used in advanced communication systems, such as 5G networks.
As the industry trends of the chip model EP3SE260F1517I2N evolve, the possibility of future upgrades to this chip model is also increasing. It is possible that the chip model will be able to support new technologies, such as artificial intelligence and machine learning, in the future. This will enable the chip model to be used in more advanced applications, such as autonomous driving, smart home, and smart city.
The chip model EP3SE260F1517I2N is also capable of being used in the era of fully intelligent systems. This chip model is designed to be used in various intelligent scenarios, such as smart home, smart city, and autonomous driving. This chip model is also capable of being used in advanced communication systems, such as 5G networks.
Overall, the chip model EP3SE260F1517I2N is an advanced integrated circuit that is designed to provide a robust and reliable platform for various applications. It is capable of providing high-speed data transmission, low-power operation, and a wide range of features. It is also capable of being used in various intelligent scenarios, such as smart home, smart city, and autonomous driving. As the industry trends of the chip model EP3SE260F1517I2N evolve, the possibility of future upgrades to this chip model is also increasing, and it is possible that the chip model will be able to support new technologies, such as artificial intelligence and machine learning, in the future.
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4,263 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||