EP3SE110F780I2N
EP3SE110F780I2N
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Altera Corporation

EP3SE110F780I2N


EP3SE110F780I2N
F53-EP3SE110F780I2N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA780,28X28,40
BGA, BGA780,28X28,40

EP3SE110F780I2N ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

EP3SE110F780I2N Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Number of Inputs 488
Number of Outputs 488
Number of Logic Cells 107500
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 100 MHz
Power Supplies 1.2/3.3 V
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
JESD-609 Code e1
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE110F780I2N Datasheet Download


EP3SE110F780I2N Overview



The chip model EP3SE110F780I2N is a high-performance device that is suitable for digital signal processing, embedded processing, and image processing. This chip model is designed to be programmed using HDL (Hardware Description Language), which is a language that is used to describe the behavior of digital circuits. The EP3SE110F780I2N chip model is a powerful device that is capable of handling complex tasks and is suitable for high-performance applications.


The EP3SE110F780I2N chip model is designed to provide a wide range of features and capabilities. It is capable of supporting multiple data types, such as integer, floating-point, and fixed-point. It is also capable of handling a variety of clock speeds and memory sizes. Furthermore, the chip model is designed to be compatible with a variety of operating systems and development environments.


The EP3SE110F780I2N chip model is designed to be used in a variety of different industries. It is suitable for use in applications such as medical imaging, aerospace, automotive, and industrial automation. The chip model is also suitable for use in consumer electronics and embedded systems.


The EP3SE110F780I2N chip model is designed to be used in a variety of different applications. It is capable of handling complex tasks and is suitable for use in high-performance applications. The chip model can be used in a variety of different industries, such as medical imaging, aerospace, automotive, and industrial automation.


The EP3SE110F780I2N chip model is designed to be used in a variety of different environments. It is capable of handling a variety of clock speeds and memory sizes, and is compatible with a variety of operating systems and development environments. The chip model is also designed to be used with a variety of different technologies, such as FPGAs, ASICs, and microcontrollers.


The EP3SE110F780I2N chip model is designed to be used in a variety of different applications. It is capable of handling complex tasks and is suitable for use in high-performance applications. The chip model can be used in a variety of different industries, such as medical imaging, aerospace, automotive, and industrial automation. In order to ensure that the chip model is used in the most optimal way, it is important to understand the specific requirements of the application. This includes understanding the product description and specific design requirements, as well as actual case studies and precautions.


In order to ensure that the EP3SE110F780I2N chip model is used in the most optimal way, it is important to understand the industry trends of the chip model and the future development of related industries. This includes understanding whether the application environment requires the support of new technologies, such as FPGAs, ASICs, and microcontrollers. Additionally, it is important to understand whether the application environment requires the support of any new technologies or tools.


The EP3SE110F780I2N chip model is a powerful device that is capable of handling complex tasks and is suitable for high-performance applications. It is designed to be used in a variety of different industries and applications. In order to ensure that the chip model is used in the most optimal way, it is important to understand the specific requirements of the application, the industry trends of the chip model and the future development of related industries, and whether the application environment requires the support of any new technologies or tools.



2,418 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote