
Altera Corporation
EP3C80F780I8N
EP3C80F780I8N ECAD Model
EP3C80F780I8N Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 429 | |
Number of Outputs | 429 | |
Number of Logic Cells | 81264 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 2.4 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, BGA780,28X28,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3C80F780I8N Datasheet Download
EP3C80F780I8N Overview
The chip model EP3C80F780I8N is a high-performance, low-power, and cost-effective FPGA (Field Programmable Gate Array) designed by Altera Corporation. It is based on the company's Cyclone III architecture and is ideal for embedded system designs. It is equipped with a total of 8,000 logic elements, 4,800 Kbits of embedded RAM, and 4,800 Kbits of distributed RAM. This chip model is also capable of supporting up to 144 user-defined I/O pins, making it an ideal choice for a wide variety of applications.
The EP3C80F780I8N chip model provides a number of advantages compared to other FPGA models. It has a low-power consumption of only 2.5W, which makes it ideal for battery-powered applications. It also has a high-speed performance of up to 200MHz, making it suitable for high-speed data processing applications. Furthermore, it has a high-density design which allows for a wide range of applications in a small form factor.
In terms of expected demand trends for the EP3C80F780I8N chip model, it is expected to be in high demand in the automotive, medical, and industrial sectors. This is due to its low power consumption, high-speed performance, and high-density design, which make it an ideal choice for these industries. Furthermore, its cost-effectiveness makes it an attractive option for these industries.
The original design intention of the EP3C80F780I8N chip model was to provide a low-cost, low-power, and high-performance FPGA solution for embedded system designs. This intention has been achieved, as the chip model is capable of providing a high-speed performance of up to 200MHz, a low-power consumption of only 2.5W, and a high-density design which allows for a wide range of applications in a small form factor.
In terms of future upgrades, the EP3C80F780I8N chip model is capable of supporting up to 144 user-defined I/O pins. This makes it an ideal choice for advanced communication systems, as it can provide the necessary functionality to support a wide range of applications. Furthermore, the chip model is capable of being upgraded with additional features, such as additional RAM, logic elements, and I/O pins.
The product description and specific design requirements of the EP3C80F780I8N chip model are as follows. It is based on the company's Cyclone III architecture and is equipped with a total of 8,000 logic elements, 4,800 Kbits of embedded RAM, and 4,800 Kbits of distributed RAM. It has a low-power consumption of only 2.5W, and a high-speed performance of up to 200MHz. Furthermore, it has a high-density design which allows for a wide range of applications in a small form factor.
In terms of actual case studies, the EP3C80F780I8N chip model has been used in a variety of applications, such as automotive, medical, and industrial applications. In these applications, it has been used to provide a low-cost, low-power, and high-performance FPGA solution. Furthermore, its high-speed performance and high-density design have allowed it to be used in a variety of advanced communication systems.
Finally, there are a few precautions that should be taken when using the EP3C80F780I8N chip model. Firstly, it is important to ensure that the chip model is compatible with the application's hardware and software requirements. Secondly, it is important to ensure that the chip model is properly configured for the application, as incorrect configuration can lead to errors. Finally, it is important to ensure that the chip model is properly maintained, as this can help to ensure its long-term reliability and performance.
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1,904 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $600.9548 | $600.9548 |
10+ | $594.4930 | $5,944.9296 |
100+ | $562.1836 | $56,218.3560 |
1000+ | $529.8742 | $264,937.0800 |
10000+ | $484.6410 | $484,641.0000 |
The price is for reference only, please refer to the actual quotation! |