EP3C80F780I8N
EP3C80F780I8N
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Altera Corporation

EP3C80F780I8N


EP3C80F780I8N
F53-EP3C80F780I8N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA780,28X28,40
BGA, BGA780,28X28,40

EP3C80F780I8N ECAD Model


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EP3C80F780I8N Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.2 V
Number of Inputs 429
Number of Outputs 429
Number of Logic Cells 81264
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
JESD-609 Code e1
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 2.4 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3C80F780I8N Datasheet Download


EP3C80F780I8N Overview



The chip model EP3C80F780I8N is a high-performance, low-power, and cost-effective FPGA (Field Programmable Gate Array) designed by Altera Corporation. It is based on the company's Cyclone III architecture and is ideal for embedded system designs. It is equipped with a total of 8,000 logic elements, 4,800 Kbits of embedded RAM, and 4,800 Kbits of distributed RAM. This chip model is also capable of supporting up to 144 user-defined I/O pins, making it an ideal choice for a wide variety of applications.


The EP3C80F780I8N chip model provides a number of advantages compared to other FPGA models. It has a low-power consumption of only 2.5W, which makes it ideal for battery-powered applications. It also has a high-speed performance of up to 200MHz, making it suitable for high-speed data processing applications. Furthermore, it has a high-density design which allows for a wide range of applications in a small form factor.


In terms of expected demand trends for the EP3C80F780I8N chip model, it is expected to be in high demand in the automotive, medical, and industrial sectors. This is due to its low power consumption, high-speed performance, and high-density design, which make it an ideal choice for these industries. Furthermore, its cost-effectiveness makes it an attractive option for these industries.


The original design intention of the EP3C80F780I8N chip model was to provide a low-cost, low-power, and high-performance FPGA solution for embedded system designs. This intention has been achieved, as the chip model is capable of providing a high-speed performance of up to 200MHz, a low-power consumption of only 2.5W, and a high-density design which allows for a wide range of applications in a small form factor.


In terms of future upgrades, the EP3C80F780I8N chip model is capable of supporting up to 144 user-defined I/O pins. This makes it an ideal choice for advanced communication systems, as it can provide the necessary functionality to support a wide range of applications. Furthermore, the chip model is capable of being upgraded with additional features, such as additional RAM, logic elements, and I/O pins.


The product description and specific design requirements of the EP3C80F780I8N chip model are as follows. It is based on the company's Cyclone III architecture and is equipped with a total of 8,000 logic elements, 4,800 Kbits of embedded RAM, and 4,800 Kbits of distributed RAM. It has a low-power consumption of only 2.5W, and a high-speed performance of up to 200MHz. Furthermore, it has a high-density design which allows for a wide range of applications in a small form factor.


In terms of actual case studies, the EP3C80F780I8N chip model has been used in a variety of applications, such as automotive, medical, and industrial applications. In these applications, it has been used to provide a low-cost, low-power, and high-performance FPGA solution. Furthermore, its high-speed performance and high-density design have allowed it to be used in a variety of advanced communication systems.


Finally, there are a few precautions that should be taken when using the EP3C80F780I8N chip model. Firstly, it is important to ensure that the chip model is compatible with the application's hardware and software requirements. Secondly, it is important to ensure that the chip model is properly configured for the application, as incorrect configuration can lead to errors. Finally, it is important to ensure that the chip model is properly maintained, as this can help to ensure its long-term reliability and performance.



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Unit Price: $646.188
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Pricing (USD)

QTY Unit Price Ext Price
1+ $600.9548 $600.9548
10+ $594.4930 $5,944.9296
100+ $562.1836 $56,218.3560
1000+ $529.8742 $264,937.0800
10000+ $484.6410 $484,641.0000
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