Altera Corporation
EP3C55F780I6
EP3C55F780I6 ECAD Model
EP3C55F780I6 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 377 | |
| Number of Outputs | 377 | |
| Number of Logic Cells | 55856 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 2.4 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA780,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3C55F780I6 Datasheet Download
EP3C55F780I6 Overview
The chip model EP3C55F780I6 has been a major player in the chip industry for some time now. It is an integrated circuit that has been designed to meet the needs of various applications. This chip model is used in a variety of industries, ranging from automotive to consumer electronics. It is also used in various communication systems, such as cellular and Wi-Fi networks.
The EP3C55F780I6 has been designed with the intention of providing a cost-effective solution for a variety of applications. This chip model is equipped with a wide range of features, such as a high-speed data processing capability, a low power consumption rate, and a high-performance memory. It also supports various technologies, such as Ethernet, Wi-Fi, Bluetooth, and Zigbee.
As the chip industry continues to evolve, the EP3C55F780I6 is likely to be upgraded in the future. This could include the addition of new features and the integration of new technologies. It is also possible that the chip could be used in advanced communication systems, such as 5G networks.
The EP3C55F780I6 could potentially be used in a variety of intelligent scenarios. This could include the ability to connect to the Internet of Things, as well as the ability to process data from sensors. It could also be used in autonomous vehicles, where it could be used to process data from cameras and other sensors. Additionally, it could be used in fully intelligent systems, such as those used in smart homes and smart cities.
Overall, the EP3C55F780I6 is a powerful and versatile chip model that is capable of supporting a variety of applications. Its ability to be upgraded in the future and its potential to be used in intelligent scenarios make it an ideal choice for a variety of industries. As the chip industry continues to evolve, the EP3C55F780I6 will continue to be an important part of the industry.
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4,287 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $378.9936 | $378.9936 |
| 10+ | $374.9184 | $3,749.1840 |
| 100+ | $354.5424 | $35,454.2400 |
| 1000+ | $334.1664 | $167,083.2000 |
| 10000+ | $305.6400 | $305,640.0000 |
| The price is for reference only, please refer to the actual quotation! | ||