Altera Corporation
EP3C55F484I8N
EP3C55F484I8N ECAD Model
EP3C55F484I8N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 327 | |
| Number of Outputs | 327 | |
| Number of Logic Cells | 55856 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.4 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3C55F484I8N Datasheet Download
EP3C55F484I8N Overview
The chip model EP3C55F484I8N is a high-performance, low-power FPGA that is designed to meet the needs of a wide variety of applications. This model is produced by Altera Corporation and is based on the Altera Cyclone III family of FPGAs. This chip model has a number of unique features that make it attractive to a wide range of industries.
The EP3C55F484I8N provides a wide range of features that are beneficial to many industries. It is designed to provide high performance, low power consumption, and high reliability. It is also designed to be scalable and upgradable, making it suitable for a variety of applications. This chip model is also designed to be compatible with a variety of communication systems, including advanced communication systems such as Ethernet, Wi-Fi, and Bluetooth.
The EP3C55F484I8N model has a number of advantages that make it attractive to many industries. It is designed to provide a high level of performance and reliability, while also providing low power consumption. It is also designed to be upgradable and compatible with a variety of communication systems, making it suitable for a variety of applications. This chip model is also designed to be scalable, allowing it to be used in a variety of different applications.
The EP3C55F484I8N is designed to meet the needs of a variety of industries, including automotive, medical, industrial, and consumer electronics. In addition, this chip model is designed to be upgradable, allowing it to be used in advanced communication systems such as Ethernet, Wi-Fi, and Bluetooth. This chip model is also designed to be scalable and upgradable, making it suitable for a variety of applications.
When designing the EP3C55F484I8N, Altera Corporation considered a number of factors to ensure it would meet the needs of a variety of industries. For example, the chip model was designed with a number of different features, such as an integrated transceiver, a high-speed transceiver, and a low-power transceiver. In addition, the chip model was designed to be upgradable and compatible with a variety of communication systems.
When using the EP3C55F484I8N, it is important to consider a number of factors to ensure that it is used correctly and safely. For example, the chip model should be used in accordance with the manufacturer's instructions and specifications, and the user should take into account the environmental conditions in which the chip model is being used. In addition, the user should be aware of the risks associated with using the chip model, such as possible electrical shock, and should take appropriate precautions when using the chip model.
Overall, the EP3C55F484I8N is a high-performance, low-power FPGA that is designed to meet the needs of a wide variety of applications. It is designed to provide a high level of performance and reliability, while also providing low power consumption. It is also designed to be upgradable and compatible with a variety of communication systems, making it suitable for a variety of applications. In addition, it is designed to be scalable, allowing it to be used in a variety of different applications. With its wide range of features, this chip model is expected to be in high demand in the future and is likely to be used in a variety of industries.
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5,454 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $355.3790 | $355.3790 |
| 10+ | $351.5578 | $3,515.5776 |
| 100+ | $332.4514 | $33,245.1360 |
| 1000+ | $313.3450 | $156,672.4800 |
| 10000+ | $286.5960 | $286,596.0000 |
| The price is for reference only, please refer to the actual quotation! | ||