
Altera Corporation
EP3C25F256C6N
EP3C25F256C6N ECAD Model
EP3C25F256C6N Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 156 | |
Number of Outputs | 156 | |
Number of Logic Cells | 24624 | |
Number of CLBs | 24624 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 24624 CLBS | |
Clock Frequency-Max | 472.5 MHz | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | R-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.55 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
EP3C25F256C6N Datasheet Download
EP3C25F256C6N Overview
The chip model EP3C25F256C6N is a high-performance device that is suitable for a wide range of applications, including digital signal processing, embedded processing, and image processing. It is designed to be used with an HDL language, which is a powerful and versatile tool for creating complex digital designs.
The EP3C25F256C6N chip offers many advantages, such as its high speed, low power consumption, and its ability to be used in a wide range of applications. The chip also has a high level of integration, which means that it can be used to create complex designs in a relatively small area. Additionally, the chip is highly scalable, allowing it to be used in a variety of applications.
The demand for the EP3C25F256C6N chip is expected to continue to grow in the future as the need for high-performance solutions increases. This chip is well-suited for a variety of applications, including embedded systems, medical devices, and even robotics. As the use of robotics and artificial intelligence increases, the demand for this chip is likely to increase as well.
The EP3C25F256C6N chip can be applied to the development and popularization of future intelligent robots. This chip is capable of processing complex tasks quickly and efficiently, making it an ideal choice for robotic applications. To use the chip effectively, a person needs to have a strong understanding of HDL language and be able to create complex designs. Additionally, knowledge of robotics and artificial intelligence is also helpful.
In conclusion, the EP3C25F256C6N chip is a powerful and versatile tool that is suitable for a wide range of applications, including digital signal processing, embedded processing, and image processing. The chip offers many advantages, such as its high speed, low power consumption, and its ability to be used in a variety of applications. The chip can also be applied to the development and popularization of future intelligent robots, and to use the model effectively, a person needs to have a strong understanding of HDL language and be knowledgeable in robotics and artificial intelligence.
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2,648 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $362.7047 | $362.7047 |
10+ | $358.8046 | $3,588.0460 |
100+ | $339.3044 | $33,930.4350 |
1000+ | $319.8041 | $159,902.0500 |
10000+ | $292.5038 | $292,503.7500 |
The price is for reference only, please refer to the actual quotation! |