EP3C25E144I8
EP3C25E144I8
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rohs

Altera Corporation

EP3C25E144I8


EP3C25E144I8
F53-EP3C25E144I8
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LFQFP, QFP144,.87SQ,20
LFQFP, QFP144,.87SQ,20

EP3C25E144I8 ECAD Model


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EP3C25E144I8 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.2 V
Number of Inputs 82
Number of Outputs 82
Number of Logic Cells 24624
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
JESD-30 Code S-PQFP-G144
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Number of Terminals 144
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP144,.87SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 20 mm
Length 20 mm
Seated Height-Max 1.65 mm
Ihs Manufacturer ALTERA CORP
Package Description LFQFP, QFP144,.87SQ,20
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3C25E144I8 Datasheet Download


EP3C25E144I8 Overview



The chip model EP3C25E144I8 is a field-programmable gate array (FPGA) developed by Altera Corporation. It is based on the 40nm low-power Arria 10 FPGA architecture and is designed to meet the needs of high-performance, low-power, and cost-sensitive applications. The EP3C25E144I8 model offers a wide range of features, including support for high-speed transceivers, high-density logic, and embedded memory, as well as advanced features such as partial reconfiguration, high-speed serial transceivers, and low-power design.


The EP3C25E144I8 chip model has many advantages over other FPGA models. It has a high-performance processor system for advanced communication systems, and its low-power design makes it suitable for applications in industries such as medical, aerospace, and automotive. It also has a high-density logic array for high-speed data processing, as well as embedded memory for data storage. In addition, the chip model is able to support partial reconfiguration, allowing for the dynamic reconfiguration of components in the system.


The EP3C25E144I8 chip model is expected to be in high demand in the future, especially in the fields of advanced communication systems, medical, aerospace, and automotive industries. With its high-performance processor system, high-density logic array, and embedded memory, the EP3C25E144I8 is well-suited for these industries. Moreover, its low-power design makes it an ideal choice for applications with power constraints.


The EP3C25E144I8 chip model is designed with the intention of providing a flexible and powerful FPGA solution. It is designed to be upgradable, allowing for the addition of new features and capabilities as needed. Additionally, the chip model is designed to be compatible with advanced communication systems, making it an ideal choice for applications in this field.


The EP3C25E144I8 chip model can also be applied to the development and popularization of future intelligent robots. Its high-performance processor system, high-density logic array, and embedded memory make it well-suited for the development of robots that require complex calculations and data processing. In addition, its low-power design makes it an ideal choice for applications with power constraints.


In order to use the EP3C25E144I8 chip model effectively, technical talents such as software engineers, hardware engineers, and system designers are needed. Software engineers are needed to program the chip model and create applications that use its features. Hardware engineers are needed to design the hardware components needed to support the chip model. System designers are needed to create the overall system architecture and ensure that all components work together.


In conclusion, the EP3C25E144I8 chip model is a powerful and flexible FPGA solution that is well-suited for advanced communication systems, medical, aerospace, and automotive industries. It is also suitable for the development of future intelligent robots. The chip model is expected to be in high demand in the future and requires technical talents such as software engineers, hardware engineers, and system designers in order to be used effectively.



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