
Altera Corporation
EP3C25E144I8
EP3C25E144I8 ECAD Model
EP3C25E144I8 Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 82 | |
Number of Outputs | 82 | |
Number of Logic Cells | 24624 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | S-PQFP-G144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP144,.87SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 20 mm | |
Length | 20 mm | |
Seated Height-Max | 1.65 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | LFQFP, QFP144,.87SQ,20 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3C25E144I8 Datasheet Download
EP3C25E144I8 Overview
The chip model EP3C25E144I8 is a field-programmable gate array (FPGA) developed by Altera Corporation. It is based on the 40nm low-power Arria 10 FPGA architecture and is designed to meet the needs of high-performance, low-power, and cost-sensitive applications. The EP3C25E144I8 model offers a wide range of features, including support for high-speed transceivers, high-density logic, and embedded memory, as well as advanced features such as partial reconfiguration, high-speed serial transceivers, and low-power design.
The EP3C25E144I8 chip model has many advantages over other FPGA models. It has a high-performance processor system for advanced communication systems, and its low-power design makes it suitable for applications in industries such as medical, aerospace, and automotive. It also has a high-density logic array for high-speed data processing, as well as embedded memory for data storage. In addition, the chip model is able to support partial reconfiguration, allowing for the dynamic reconfiguration of components in the system.
The EP3C25E144I8 chip model is expected to be in high demand in the future, especially in the fields of advanced communication systems, medical, aerospace, and automotive industries. With its high-performance processor system, high-density logic array, and embedded memory, the EP3C25E144I8 is well-suited for these industries. Moreover, its low-power design makes it an ideal choice for applications with power constraints.
The EP3C25E144I8 chip model is designed with the intention of providing a flexible and powerful FPGA solution. It is designed to be upgradable, allowing for the addition of new features and capabilities as needed. Additionally, the chip model is designed to be compatible with advanced communication systems, making it an ideal choice for applications in this field.
The EP3C25E144I8 chip model can also be applied to the development and popularization of future intelligent robots. Its high-performance processor system, high-density logic array, and embedded memory make it well-suited for the development of robots that require complex calculations and data processing. In addition, its low-power design makes it an ideal choice for applications with power constraints.
In order to use the EP3C25E144I8 chip model effectively, technical talents such as software engineers, hardware engineers, and system designers are needed. Software engineers are needed to program the chip model and create applications that use its features. Hardware engineers are needed to design the hardware components needed to support the chip model. System designers are needed to create the overall system architecture and ensure that all components work together.
In conclusion, the EP3C25E144I8 chip model is a powerful and flexible FPGA solution that is well-suited for advanced communication systems, medical, aerospace, and automotive industries. It is also suitable for the development of future intelligent robots. The chip model is expected to be in high demand in the future and requires technical talents such as software engineers, hardware engineers, and system designers in order to be used effectively.
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