Altera Corporation
EP3C120F780C8NES
EP3C120F780C8NES ECAD Model
EP3C120F780C8NES Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of CLBs | 119088 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Organization | 119088 CLBS | |
| Clock Frequency-Max | 472.5 MHz | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | R-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 29 X 29 MM, 2.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3C120F780C8NES Overview
The chip model EP3C120F780C8NES is a cutting-edge integrated circuit that is designed for a variety of applications. It is a highly versatile, low-power FPGA (Field Programmable Gate Array) that is capable of providing high-performance computing for a variety of applications. It is a highly efficient, low-cost solution for a wide range of applications, including computing, communication, and industrial control.
The EP3C120F780C8NES chip model is designed to provide a wide range of advantages over other similar designs. It offers higher performance and lower power consumption than other similar designs, making it suitable for a range of applications. It also offers a wide range of features, including support for a variety of communication protocols, support for multiple I/O formats, and support for a variety of memory technologies. Additionally, it offers the flexibility of being reconfigurable, allowing it to be used in a variety of applications.
The EP3C120F780C8NES chip model is expected to experience an increasing demand in the coming years due to its wide range of advantages. It is expected to be used in a variety of industries, including automotive, industrial, and consumer electronics. Additionally, it is expected to be used in a variety of applications, including networking, communications, and industrial control.
The original design intention of the EP3C120F780C8NES chip model was to provide a reliable, low-power, and high-performance solution for a wide range of applications. It is designed to be highly reliable, with a long life-cycle and low power consumption. Additionally, it is designed to be highly flexible, allowing it to be used in a variety of applications.
The EP3C120F780C8NES chip model is also designed to be easily upgradable. It has a modular design, allowing it to be easily upgraded to support new technologies and features. This makes it suitable for use in a variety of applications, including networking, communications, and industrial control. Additionally, it is designed to be able to support a variety of communication protocols, allowing it to be used in a variety of applications.
The EP3C120F780C8NES chip model is expected to be used in a variety of networks and intelligent scenarios in the future. It is expected to be used in a variety of applications, including networking, communications, and industrial control. Additionally, it is expected to be used in a variety of intelligent scenarios, such as smart homes, smart cities, and autonomous vehicles. Additionally, it is expected to be used in the era of fully intelligent systems, allowing it to be used in a variety of applications.
2,597 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||