EP2SGX90EF35C5NES
EP2SGX90EF35C5NES
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rohs

Altera Corporation

EP2SGX90EF35C5NES


EP2SGX90EF35C5NES
F53-EP2SGX90EF35C5NES
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

EP2SGX90EF35C5NES ECAD Model


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EP2SGX90EF35C5NES Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.2 V
Number of CLBs 4828
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL EXTENDED
Package Shape SQUARE
Technology CMOS
Organization 4828 CLBS
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
JESD-30 Code S-PBGA-B35
Qualification Status Not Qualified
JESD-609 Code e1
Operating Temperature-Max 85 °C
Number of Terminals 35
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer ALTERA CORP
Part Package Code PGA
Package Description BGA,
Pin Count 35
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP2SGX90EF35C5NES Datasheet Download


EP2SGX90EF35C5NES Overview



The chip model EP2SGX90EF35C5NES is a high-performance, low-power FPGA (Field Programmable Gate Array) designed for digital signal processing, embedded processing and image processing applications. It is designed to be used with HDL (Hardware Description Language) and is capable of delivering high performance and low power consumption.


The EP2SGX90EF35C5NES offers several advantages over other FPGA models. It has a large capacity of up to 90,000 logic elements and 4,000Kbits of embedded memory, making it suitable for complex applications. It also features a low-power architecture, which helps reduce power consumption while maintaining performance. Additionally, the chip model is designed to be flexible, allowing developers to customize the design to meet their specific needs.


The demand for the EP2SGX90EF35C5NES chip model is expected to grow in the future, as more industries become dependent on digital signal processing, embedded processing and image processing applications. The chip model's low-power architecture, high performance and flexible design make it an attractive option for these industries.


When designing products with the EP2SGX90EF35C5NES chip model, it is important to consider the specific design requirements of the application. This includes the number of logic elements needed, the type of memory required and the power requirements of the system. Additionally, it is important to consider any potential issues that could arise with the design, such as timing constraints or signal integrity.


In order to ensure the successful implementation of the EP2SGX90EF35C5NES chip model, it is important to study actual case studies and take precautions to avoid potential issues. For example, developers should familiarize themselves with the HDL language used to program the chip model and the design process for the application. Additionally, it is important to test the design thoroughly and make sure that all components are working properly.


Overall, the EP2SGX90EF35C5NES chip model is an attractive option for digital signal processing, embedded processing and image processing applications. With its low-power architecture, high performance and flexible design, the chip model is expected to become increasingly popular in the future. When designing products with the chip model, it is important to consider the specific design requirements of the application and take precautions to ensure the successful implementation of the chip model.



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