Altera Corporation
EP2SGX30CF780I5N
EP2SGX30CF780I5N ECAD Model
EP2SGX30CF780I5N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 361 | |
| Number of Outputs | 361 | |
| Number of Logic Cells | 33380 | |
| Number of CLBs | 33880 | |
| Combinatorial Delay of a CLB-Max | 4.006 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 33880 CLBS | |
| Clock Frequency-Max | 622.08 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 | |
| Pin Count | 780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2SGX30CF780I5N Datasheet Download
EP2SGX30CF780I5N Overview
The chip model EP2SGX30CF780I5N is a powerful and efficient processor that has been designed to meet the needs of the modern world. It is capable of providing high performance and low power consumption, making it a great choice for many applications. As the demand for more powerful and efficient processors increases, the chip model EP2SGX30CF780I5N is likely to become more popular in the near future.
When it comes to the industry trends of the chip model EP2SGX30CF780I5N, it is important to consider the future development of related industries. As technology advances, the need for more powerful and efficient processors is likely to increase. This could mean more applications for the chip model EP2SGX30CF780I5N, as well as the need for new technologies to support these applications.
The original design intention of the chip model EP2SGX30CF780I5N was to provide a powerful and efficient processor that could be used in a variety of applications. It is likely that the chip model will be able to be upgraded in the future to meet the needs of more advanced communication systems. This could mean that the chip model EP2SGX30CF780I5N could be used in the development and popularization of future intelligent robots.
In order to use the chip model EP2SGX30CF780I5N effectively, it is important to have the right technical talents. Those with a good understanding of computer hardware and software will be able to use the chip model to its fullest potential. It is also important to have a good understanding of the application environment in order to ensure that the chip model is used correctly.
In conclusion, the chip model EP2SGX30CF780I5N is a powerful and efficient processor that is likely to become more popular in the near future. The industry trends of the chip model, as well as its original design intention, suggest that it could be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to have the right technical talents and a good understanding of the application environment.
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|---|---|---|
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