Altera Corporation
EP2SGX30CF780I3
EP2SGX30CF780I3 ECAD Model
EP2SGX30CF780I3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 361 | |
| Number of Outputs | 361 | |
| Number of Logic Cells | 33380 | |
| Number of CLBs | 33880 | |
| Combinatorial Delay of a CLB-Max | 2.99 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 33880 CLBS | |
| Clock Frequency-Max | 622.08 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, 1 MM PITCH, FBGA-780 | |
| Pin Count | 780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2SGX30CF780I3 Datasheet Download
EP2SGX30CF780I3 Overview
The chip model EP2SGX30CF780I3 is a powerful and versatile device, designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is designed to be programmed in HDL language, making it an ideal choice for high-performance applications.
The original design intention of the chip model EP2SGX30CF780I3 was to provide a powerful and reliable platform for digital signal processing and embedded processing applications. It is also capable of being upgraded for more advanced applications, such as those requiring more complex algorithms and more powerful processing capabilities. This makes the chip model EP2SGX30CF780I3 a great choice for those seeking to develop advanced communication systems.
The chip model EP2SGX30CF780I3 is also suitable for use in network applications, such as those requiring high-speed data transfer, as well as intelligent scenarios. It is capable of being used in the era of fully intelligent systems, as it is equipped with powerful processing capabilities and advanced algorithms. This makes the chip model EP2SGX30CF780I3 an ideal choice for those seeking to develop intelligent systems and networks.
Overall, the chip model EP2SGX30CF780I3 is a powerful and versatile device, designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is capable of being upgraded for more advanced applications, and can be used in intelligent scenarios and networks. This makes the chip model EP2SGX30CF780I3 an ideal choice for those seeking to develop advanced communication systems, intelligent systems, and networks.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||