Altera Corporation
EP2S130F780I5
EP2S130F780I5 ECAD Model
EP2S130F780I5 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 534 | |
| Number of Outputs | 526 | |
| Number of Logic Cells | 132540 | |
| Number of CLBs | 7047 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7047 CLBS | |
| Power Supplies | 1.2,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA780,28X28,40 | |
| Pin Count | 780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2S130F780I5 Datasheet Download
EP2S130F780I5 Overview
The chip model EP2S130F780I5 is a product of the Altera Corporation, a leader in the field of programmable logic devices. This particular model is a field-programmable gate array (FPGA) which is designed to be used in a variety of applications, from automotive and industrial to communications and data processing. The chip model is designed to be easily reconfigurable and can be used for a variety of tasks.
The EP2S130F780I5 chip model offers several advantages over other FPGAs. It features a low power consumption and a high performance-to-power ratio, making it an ideal choice for applications that require both speed and efficiency. Additionally, the chip model is designed to be highly reliable and durable, making it well-suited for use in industrial and automotive applications.
The chip model also has the potential to be upgraded in the future. It is designed to be compatible with a range of advanced communication systems, which could potentially allow it to be used in a variety of applications. This could open up a wide range of possibilities for the chip model, such as enabling it to be used in the development of new technologies.
The EP2S130F780I5 chip model is expected to be in high demand in the coming years. It is an ideal choice for applications that require both speed and efficiency, and its compatibility with advanced communication systems makes it a great choice for the development of new technologies. Moreover, its low power consumption and high performance-to-power ratio make it an attractive option for industrial and automotive applications.
In conclusion, the EP2S130F780I5 chip model is a great choice for a variety of applications. Its low power consumption and high performance-to-power ratio make it an ideal choice for applications that require both speed and efficiency. Additionally, its compatibility with advanced communication systems makes it well-suited for use in the development of new technologies. Its potential for future upgrades makes it an attractive option for a variety of applications.
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| QTY | Unit Price | Ext Price |
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