
Altera Corporation
EP2S130F780I4
EP2S130F780I4 ECAD Model
EP2S130F780I4 Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 534 | |
Number of Outputs | 526 | |
Number of Logic Cells | 132540 | |
Number of CLBs | 7047 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 7047 CLBS | |
Power Supplies | 1.2,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | 29 X 29 MM, 1 MM PITCH, FBGA-780 | |
Pin Count | 780 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP2S130F780I4 Datasheet Download
EP2S130F780I4 Overview
The chip model EP2S130F780I4 is a high-performance, low-power FPGA designed for digital signal processing, embedded processing, and image processing. It is an ideal choice for applications that require reliable and efficient computing power. Furthermore, this chip model supports the use of HDL language, which is essential for the development of digital signal processing, embedded processing, and image processing.
The industry trends of the chip model EP2S130F780I4 and the future development of related industries depend on the specific technologies needed for the application environment. As the technology evolves, new technologies such as AI, machine learning, and 5G will become increasingly important for the development of digital signal processing, embedded processing, and image processing.
The chip model EP2S130F780I4 can be used in networks and intelligent scenarios such as autonomous driving, smart homes, and industrial automation. It can also be used in the era of fully intelligent systems by leveraging its advanced computing power and low power consumption. This chip model is capable of performing complex operations and can be used to develop systems with high performance and reliability.
In conclusion, the chip model EP2S130F780I4 is an ideal choice for digital signal processing, embedded processing, and image processing. It is capable of performing complex operations and can be used in networks and intelligent scenarios. Furthermore, it is capable of supporting the development of fully intelligent systems with its advanced computing power and low power consumption. As the technology continues to evolve, this chip model will become increasingly important for the development of digital signal processing, embedded processing, and image processing.
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