EP2C20F484I6N
EP2C20F484I6N
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Altera Corporation

EP2C20F484I6N


EP2C20F484I6N
F53-EP2C20F484I6N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA484,22X22,40
BGA, BGA484,22X22,40

EP2C20F484I6N ECAD Model


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EP2C20F484I6N Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.2 V
Number of Inputs 315
Number of Outputs 299
Number of Logic Cells 18752
Number of CLBs 1196
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1196 CLBS
Additional Feature ALSO REQUIRES 3.3 SUPPLY
Power Supplies 1.2,1.5/3.3,3.3 V
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description BGA, BGA484,22X22,40
Pin Count 484
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP2C20F484I6N Datasheet Download


EP2C20F484I6N Overview



The chip model EP2C20F484I6N is an integrated circuit developed by Altera, Inc. and is a member of the Cyclone II family. It is a low-cost, low-power FPGA that is ideal for embedded applications such as industrial automation and control, automotive, consumer, and medical systems. It features a high-performance and low-power design, as well as a wide range of features that make it suitable for a variety of applications.


The EP2C20F484I6N chip model has a number of advantages that make it attractive for use in embedded applications. It has a low power consumption of less than 1W, which makes it suitable for battery-operated devices. It also has a high-performance design, with a maximum operating frequency of 250MHz and a maximum operating temperature of 105°C. Additionally, it offers a wide range of features, including multiple I/O standards, a wide range of logic elements, and a large amount of memory.


In terms of industry trends, the EP2C20F484I6N chip model is expected to see increased demand in the near future. This is due to its low-cost and low-power design, as well as its wide range of features that make it suitable for a variety of embedded applications. Additionally, its high-performance design makes it suitable for use in applications that require high-speed operation, such as automotive and medical systems.


In terms of the product description and specific design requirements of the EP2C20F484I6N chip model, it is important to consider a variety of factors. These include the power consumption, the operating frequency, the logic elements, the memory size, and the I/O standards. Additionally, it is important to consider the specific application requirements and the environment in which the chip will be used.


There are also a number of case studies and precautions that should be taken when designing with the EP2C20F484I6N chip model. For example, it is important to ensure that the power consumption of the chip is within the specified limits. Additionally, the chip should be designed with a margin of safety to ensure that it will not be damaged by sudden power surges or temperature fluctuations. Additionally, the chip should be tested to ensure that it meets the specific application requirements.


In conclusion, the EP2C20F484I6N chip model is a low-cost and low-power FPGA that is suitable for a variety of embedded applications. It has a high-performance design and a wide range of features, making it suitable for high-speed operations. Additionally, it is important to consider the power consumption, the operating frequency, the logic elements, the memory size, and the I/O standards when designing with the chip model. Additionally, it is important to take into account the specific application requirements and the environment in which the chip will be used, as well as any case studies and precautions that should be taken when designing with the chip model.



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Unit Price: $90.7363
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QTY Unit Price Ext Price
1+ $84.3848 $84.3848
10+ $83.4774 $834.7740
100+ $78.9406 $7,894.0581
1000+ $74.4038 $37,201.8830
10000+ $68.0522 $68,052.2250
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