Altera Corporation
EP2C20F256I6
EP2C20F256I6 ECAD Model
EP2C20F256I6 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 152 | |
| Number of Outputs | 136 | |
| Number of Logic Cells | 18752 | |
| Number of CLBs | 1196 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1196 CLBS | |
| Additional Feature | ALSO REQUIRES 3.3 SUPPLY | |
| Power Supplies | 1.2,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2C20F256I6 Datasheet Download
EP2C20F256I6 Overview
The chip model EP2C20F256I6 is an advanced integrated circuit designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a field-programmable gate array (FPGA) device and requires the use of a hardware description language (HDL) for programming. The EP2C20F256I6 is a powerful chip model and provides a wide range of features that make it suitable for many applications.
The EP2C20F256I6 features a high-speed, low-power, and high-density architecture with an on-chip memory of 256 Kbits. It is capable of processing data at speeds up to 200MHz and can be used in a wide range of applications such as industrial automation, robotics, and medical imaging. The chip model is also suitable for applications such as high-speed communications, data acquisition, and embedded systems.
The EP2C20F256I6 provides a number of advantages over other chip models. It is designed to be highly efficient and power-efficient, allowing for greater performance in a smaller package. It also offers a high level of integration, allowing for greater flexibility in system design. The chip model is also designed to be highly reliable and is capable of operating in harsh environmental conditions.
The EP2C20F256I6 is expected to be in high demand in the future due to its wide range of features and its ability to meet the increasing demands of the digital world. It is likely to be used in a variety of applications, including high-speed communications, data acquisition, and embedded systems. As the chip model is designed to be highly reliable, it is expected to be used in many advanced communication systems.
The original design intention of the EP2C20F256I6 was to provide a high-performance, low-power, and high-density chip model that could be used in a variety of applications. The chip model was designed to be highly reliable and was designed to be able to operate in harsh environmental conditions. The chip model is also designed to be highly efficient and power-efficient, allowing for greater performance in a smaller package.
The EP2C20F256I6 is capable of being upgraded in the future to meet the changing needs of the digital world. It is also possible to upgrade the chip model to include additional features such as support for advanced communication systems. The chip model is also capable of being used in a variety of applications, including high-speed communications, data acquisition, and embedded systems.
Overall, the EP2C20F256I6 is an advanced chip model that is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a powerful chip model and provides a wide range of features that make it suitable for many applications. The chip model is expected to be in high demand in the future due to its wide range of features and its ability to meet the increasing demands of the digital world. It is also capable of being upgraded in the future to meet the changing needs of the digital world.
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3,887 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $73.9240 | $73.9240 |
| 10+ | $73.1291 | $731.2914 |
| 100+ | $69.1547 | $6,915.4734 |
| 1000+ | $65.1803 | $32,590.1620 |
| 10000+ | $59.6162 | $59,616.1500 |
| The price is for reference only, please refer to the actual quotation! | ||