
Altera Corporation
EP20K400CF672I9
EP20K400CF672I9 ECAD Model
EP20K400CF672I9 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Number of Inputs | 480 | |
Number of Outputs | 480 | |
Number of Logic Cells | 16640 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Power Supplies | 1.8,1.8/3.3 V | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, BGA672,26X26,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP20K400CF672I9 Datasheet Download
EP20K400CF672I9 Overview
The EP20K400CF672I9 chip model is a powerful, low-power programmable logic device (PLD) developed by Altera Corporation. It is designed to meet the needs of high-performance and low-power applications, such as telecommunications, automotive, industrial, and consumer electronics. The chip model is highly configurable and can be used to create a wide range of logic designs, including high-speed logic cores, embedded processors, and complex digital signal processing (DSP) functions.
The EP20K400CF672I9 chip model offers several advantages over other PLDs. It has an optimal balance between power efficiency and performance, allowing for high-speed operation at low power levels. In addition, it is highly configurable, allowing for custom logic design and the integration of multiple functions into a single device. It is also capable of supporting multiple clock domains, allowing for faster and more efficient operation.
The EP20K400CF672I9 chip model is expected to be in high demand in the coming years, as the need for low-power logic devices increases. The chip model has already seen success in the telecommunications and automotive industries, and is expected to be increasingly used in industrial and consumer electronics applications. Additionally, the chip model is expected to be used in networks and intelligent scenarios, as the need for low-power, high-performance logic devices increases.
The EP20K400CF672I9 chip model is designed to meet specific design requirements. It is a low-power, high-performance device, capable of supporting multiple clock domains and custom logic designs. The chip model is highly configurable, allowing for the integration of multiple functions into a single device. Additionally, it is capable of supporting multiple clock domains, allowing for faster and more efficient operation.
The EP20K400CF672I9 chip model has been successfully used in a variety of applications, including telecommunications, automotive, industrial, and consumer electronics. In the telecommunications industry, the chip model has been used to create high-speed logic cores and embedded processors. In the automotive industry, the chip model has been used to create complex digital signal processing (DSP) functions. Additionally, in the industrial and consumer electronics industries, the chip model has been used to create a wide range of logic designs.
When using the EP20K400CF672I9 chip model, it is important to take certain precautions. The chip model is highly configurable, so it is important to ensure that all design parameters are correctly configured. Additionally, it is important to ensure that the chip model is operating within its specified power and performance parameters, as operating outside of these parameters can lead to decreased performance or device failure. Finally, it is important to ensure that the chip model is properly cooled, as overheating can lead to device failure.
The EP20K400CF672I9 chip model is a powerful and highly configurable device, capable of meeting the needs of high-performance and low-power applications. It is expected to be in high demand in the coming years, as the need for low-power logic devices increases. The chip model has already seen success in a variety of industries, and is expected to be used in networks and intelligent scenarios in the future. It is important to ensure that all design parameters are correctly configured and that the chip model is operating within its specified power and performance parameters. Additionally, it is important to ensure that the chip model is properly cooled to avoid device failure.
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1,984 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $647.4930 | $647.4930 |
10+ | $640.5307 | $6,405.3068 |
100+ | $605.7192 | $60,571.9230 |
1000+ | $570.9078 | $285,453.8900 |
10000+ | $522.1718 | $522,171.7500 |
The price is for reference only, please refer to the actual quotation! |