EP20K30ETC144-3X
EP20K30ETC144-3X
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rohs

Altera Corporation

EP20K30ETC144-3X


EP20K30ETC144-3X
F53-EP20K30ETC144-3X
Active
LOADABLE PLD, 3.98 ns, CMOS, LFQFP
LFQFP

EP20K30ETC144-3X ECAD Model


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EP20K30ETC144-3X Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Propagation Delay 3.98 ns
Number of Dedicated Inputs 4
Number of I/O Lines 92
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 92 I/O
Clock Frequency-Max 160 MHz
Output Function MACROCELL
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PQFP-G144
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 144
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 20 mm
Length 20 mm
Seated Height-Max 1.6 mm
Ihs Manufacturer ALTERA CORP
Package Description LFQFP,
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Part Package Code QFP
Pin Count 144

EP20K30ETC144-3X Datasheet Download


EP20K30ETC144-3X Overview



The chip model EP20K30ETC144-3X is a high-tech product developed by a leading semiconductor manufacturer. It is a complex and powerful integrated circuit that has a wide range of applications in the communication industry. The chip model EP20K30ETC144-3X has been designed to meet the needs of modern communication systems, providing robust and reliable performance.


The chip model EP20K30ETC144-3X is built with a wide range of features, including advanced data processing and storage capabilities, as well as an extensive range of communications protocols. It is also equipped with an integrated power management system, which ensures optimal performance and reliability. The chip model EP20K30ETC144-3X is also designed to be upgradable, allowing for future upgrades and expansion of its capabilities.


The chip model EP20K30ETC144-3X is designed to be used in a variety of applications, including wireless communication systems, mobile phone networks, and advanced communication systems. It is also designed to be used in the development of new technologies, such as the Internet of Things (IoT) and 5G networks. In order to ensure its compatibility with these new technologies, the chip model EP20K30ETC144-3X is designed to be compatible with a wide range of communication protocols, such as 802.11, Bluetooth, and Zigbee.


In order to ensure the successful implementation of the chip model EP20K30ETC144-3X, it is important to understand the product design requirements and the actual case studies. It is also important to understand the potential risks associated with the chip model EP20K30ETC144-3X, such as potential hardware and software issues, as well as the potential for security breaches. It is also important to understand the environmental requirements for the chip model EP20K30ETC144-3X, such as temperature, humidity, and electromagnetic interference.


The chip model EP20K30ETC144-3X is an advanced and powerful integrated circuit that has a wide range of applications in the communication industry. It is designed to meet the needs of modern communication systems, providing robust and reliable performance. The chip model EP20K30ETC144-3X is also designed to be upgradable, allowing for future upgrades and expansion of its capabilities. In order to ensure the successful implementation of the chip model EP20K30ETC144-3X, it is important to understand the product design requirements and the actual case studies, as well as the potential risks associated with the chip model EP20K30ETC144-3X.



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