EP1SGX25FF1020C7ES
EP1SGX25FF1020C7ES
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rohs

Altera Corporation

EP1SGX25FF1020C7ES


EP1SGX25FF1020C7ES
F53-EP1SGX25FF1020C7ES
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 33 X 33 MM, 1 MM PITCH, FBGA-1020
33 X 33 MM, 1 MM PITCH, FBGA-1020

EP1SGX25FF1020C7ES ECAD Model


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EP1SGX25FF1020C7ES Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1020
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 85 °C
Number of Terminals 1020
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 33 mm
Length 33 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 33 X 33 MM, 1 MM PITCH, FBGA-1020
Pin Count 1020
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP1SGX25FF1020C7ES Datasheet Download


EP1SGX25FF1020C7ES Overview



The chip model EP1SGX25FF1020C7ES is a high-performance product designed by Altera Corporation, a leading provider of semiconductor solutions. It is an FPGA (Field Programmable Gate Array) chip, which is a type of integrated circuit that can be configured by a user to meet specific needs. The chip model is built with a wide range of features, including high-speed transceivers, high-speed memory interface, and customizable I/O.


The original design intention of the chip model EP1SGX25FF1020C7ES is to provide a high-performance and reliable platform for advanced communication systems. It is equipped with a range of features that are designed to meet the needs of modern communication networks. These features include high-speed transceivers, high-speed memory interface, and customizable I/O. The chip model is also designed with the capability to be easily upgraded in the future to meet the changing needs of communication systems.


The chip model EP1SGX25FF1020C7ES has the potential to be applied to a variety of advanced communication systems. It can be used in networks such as wireless networks, cellular networks, and even the Internet of Things. It can also be used in intelligent scenarios such as artificial intelligence (AI) and machine learning. The chip model is designed to be able to handle the increasing data traffic and complexity of modern networks, making it suitable for the era of fully intelligent systems.


The product description and specific design requirements of the chip model EP1SGX25FF1020C7ES are available in the product datasheet. The datasheet provides detailed information on the features, specifications, and design requirements of the chip model. It also includes actual case studies and precautions that should be taken while using the chip model.


In conclusion, the chip model EP1SGX25FF1020C7ES is a high-performance product designed to meet the needs of advanced communication systems. It is equipped with a range of features that are designed to meet the needs of modern communication networks. The chip model has the potential to be applied to a variety of advanced communication systems and intelligent scenarios. The product description and specific design requirements of the chip model are available in the product datasheet, along with actual case studies and precautions.



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