Altera Corporation
EP1SGX10DF672I7N
EP1SGX10DF672I7N ECAD Model
EP1SGX10DF672I7N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 362 | |
| Number of Outputs | 362 | |
| Number of Logic Cells | 10570 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 1.5,1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 135 °C | |
| Operating Temperature-Min | -65 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 672 | |
| ECCN Code | 3A001.A.2.A |
EP1SGX10DF672I7N Datasheet Download
EP1SGX10DF672I7N Overview
The chip model EP1SGX10DF672I7N is a new development in the semiconductor industry, and it has the potential to revolutionize the industry. It is a low-power, high-performance, embedded processor with a 32-bit core, a Cortex-A9 processor, and a rich set of peripherals and interfaces. It has been designed to support a wide range of applications, from consumer electronics to industrial automation.
The EP1SGX10DF672I7N is designed to provide an optimized solution for embedded applications, such as embedded systems, audio/video processing, and industrial automation. It integrates a range of features, including a low-power design, a high-performance processor, and a rich set of peripherals and interfaces. The chip model also supports a wide range of communication protocols, such as Ethernet, USB, and CAN.
The EP1SGX10DF672I7N is an ideal solution for applications that require a high level of performance and low power consumption. It is designed to be used in a wide range of applications, including consumer electronics, industrial automation, and embedded systems. It is also capable of supporting advanced communication systems, such as 5G and Wi-Fi 6.
In terms of future development and upgrades, the EP1SGX10DF672I7N is designed to be highly flexible and upgradeable. It is capable of supporting new technologies, such as artificial intelligence (AI) and machine learning (ML). Additionally, it is designed to be able to support the latest communication protocols, such as Bluetooth 5.2 and Wi-Fi 6.
In terms of product description and design requirements, the EP1SGX10DF672I7N is designed to meet the needs of a wide range of applications. It has a wide range of features, including a low-power design, a high-performance processor, and a rich set of peripherals and interfaces. It is also designed to be highly reliable and robust, with a range of safety features, such as ESD protection and overvoltage protection.
In terms of actual case studies and precautions, the EP1SGX10DF672I7N has been used in a variety of applications, such as medical devices, industrial automation, and consumer electronics. It has been tested and proven to be reliable and robust, and it has been used in a wide range of applications. Additionally, it has been designed to be highly secure, with a range of security features, such as secure boot and secure bootloader.
Overall, the EP1SGX10DF672I7N is an ideal solution for a wide range of applications, from consumer electronics to industrial automation. It is designed to provide an optimized solution for embedded applications, with a low-power design, a high-performance processor, and a rich set of peripherals and interfaces. It is also capable of supporting advanced communication systems, such as 5G and Wi-Fi 6, and it is designed to be highly flexible and upgradeable, with the ability to support new technologies, such as AI and ML. In terms of product description and design requirements, it is designed to meet the needs of a wide range of applications, with a range of safety and security features. Finally, it has been tested and proven to be reliable and robust, with a range of actual case studies and precautions.
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