
Altera Corporation
EP1SGX10CF672I6N
EP1SGX10CF672I6N ECAD Model
EP1SGX10CF672I6N Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 362 | |
Number of Outputs | 362 | |
Number of Logic Cells | 10570 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Power Supplies | 1.5,1.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 135 °C | |
Operating Temperature-Min | -65 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-672 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 672 | |
ECCN Code | 3A001.A.2.A |
EP1SGX10CF672I6N Datasheet Download
EP1SGX10CF672I6N Overview
The chip model EP1SGX10CF672I6N is a powerful and versatile device that is at the forefront of the industry. It is a Field Programmable Gate Array (FPGA) that is highly configurable and can be used in a variety of applications. This chip has been designed to meet the needs of today’s most demanding applications and to provide users with the utmost flexibility.
In terms of industry trends, the chip model EP1SGX10CF672I6N is capable of handling the most advanced communication systems. It is equipped with features such as high-speed transceivers, high-speed memory, and advanced signal processing that make it a perfect choice for a wide range of applications. It is also designed to be highly efficient, making it an ideal choice for applications that require low power consumption.
The original design intention of the chip model EP1SGX10CF672I6N was to provide users with a high-performance and cost-effective solution. It is designed to be highly configurable and can be used in a variety of applications. It is also designed to be highly reliable and can be used in mission-critical applications.
In terms of future upgrades, the chip model EP1SGX10CF672I6N is designed to be highly scalable and can be easily upgraded with new features and technologies. It is also designed to be highly reliable and can be used in mission-critical applications. This chip is also designed to be highly flexible, allowing for the use of different technologies to meet the needs of different applications.
The product description of the chip model EP1SGX10CF672I6N includes features such as high-speed transceivers, high-speed memory, and advanced signal processing. It is also designed to be highly configurable, allowing for the use of different technologies to meet the needs of different applications. It is also designed to be highly reliable and can be used in mission-critical applications.
In terms of actual case studies, the chip model EP1SGX10CF672I6N has been used in a variety of applications. It has been used in the aerospace industry, in medical devices, and in the automotive industry. It has also been used in data centers, in industrial automation, and in the military. In each of these applications, the chip model EP1SGX10CF672I6N has proven to be reliable and efficient.
In terms of precautions, the chip model EP1SGX10CF672I6N should be used in accordance with the manufacturer’s specifications. It should also be used in an environment that is free from dust and debris. Additionally, it should be regularly inspected for any signs of damage or wear.
In conclusion, the chip model EP1SGX10CF672I6N is a powerful and versatile device that is at the forefront of the industry. It is a Field Programmable Gate Array (FPGA) that is highly configurable and can be used in a variety of applications. In terms of industry trends, the chip model EP1SGX10CF672I6N is capable of handling the most advanced communication systems. It is also designed to be highly efficient, making it an ideal choice for applications that require low power consumption. The product description of the chip model EP1SGX10CF672I6N includes features such as high-speed transceivers, high-speed memory, and advanced signal processing. It is also designed to be highly reliable and can be used in mission-critical applications. In terms of actual case studies, the chip model EP1SGX10CF672I6N has been used in a variety of applications and has proven to be reliable and efficient. In terms of precautions, the chip model EP1SGX10CF672I6N should be used in accordance with the manufacturer’s specifications and in an environment that is free from dust and debris.
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5,776 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $47.5936 | $47.5936 |
10+ | $47.0818 | $470.8183 |
100+ | $44.5230 | $4,452.3033 |
1000+ | $41.9642 | $20,982.1190 |
10000+ | $38.3819 | $38,381.9250 |
The price is for reference only, please refer to the actual quotation! |