
Altera Corporation
EP1SGX10CF672I5N
EP1SGX10CF672I5N ECAD Model
EP1SGX10CF672I5N Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 362 | |
Number of Outputs | 362 | |
Number of Logic Cells | 10570 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Power Supplies | 1.5,1.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 135 °C | |
Operating Temperature-Min | -65 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | BGA, BGA672,26X26,40 | |
Pin Count | 672 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.2.A |
EP1SGX10CF672I5N Datasheet Download
EP1SGX10CF672I5N Overview
The chip model EP1SGX10CF672I5N is a high-performance FPGA (Field Programmable Gate Array) from Altera, a leading semiconductor company. It is designed to meet the needs of various industries, from automotive to communication and industrial automation. The chip model is based on the 28nm Intel Stratix 10 FPGA architecture and is equipped with 672K logic elements, 10.5Mb of embedded memory, and up to 8 banks of DDR4 memory controllers.
The original design intention of the chip model EP1SGX10CF672I5N is to provide a high-performance and cost-effective solution for applications such as high-speed data processing, image processing, and high-speed networking. It is designed to be used in a wide range of applications, including networking, storage, and communication. The chip model is also designed to be easily upgradable and can be used in advanced communication systems.
The product description of the chip model EP1SGX10CF672I5N includes its features and specifications, as well as its design requirements. It provides a wide range of features, including a high-speed transceiver, high-speed memory controllers, and up to 8 banks of DDR4 memory. It also has a wide range of I/O capabilities, including LVDS, PCIe, and USB. In addition, the chip model is designed for low-power operation, making it suitable for use in embedded applications.
Case studies have demonstrated that the chip model EP1SGX10CF672I5N is suitable for a wide range of applications, including high-speed data processing, image processing, and high-speed networking. It is also suitable for use in advanced communication systems, such as 5G, Wi-Fi, and Bluetooth. However, it is important to note that the chip model is not suitable for use in certain applications, such as medical imaging and autonomous driving. Therefore, it is important to consider the specific requirements of the application before selecting the chip model.
The chip model EP1SGX10CF672I5N is also suitable for the development and popularization of future intelligent robots. As robots become increasingly sophisticated, they require more powerful processors and memory. The chip model is designed to meet the needs of robots, with its high-performance transceiver, high-speed memory controllers, and up to 8 banks of DDR4 memory. In addition, the chip model is designed for low-power operation, making it suitable for use in embedded applications.
In order to use the chip model EP1SGX10CF672I5N effectively, it is important to have the right technical talents. These include engineers with expertise in hardware design, software development, and embedded systems. It is also important to have a good understanding of the chip model’s features and specifications, as well as its design requirements. In addition, it is important to have a good understanding of the application in which the chip model will be used, in order to ensure that it is suitable for the application.
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