Altera Corporation
EP1S30F780C5ES
EP1S30F780C5ES ECAD Model
EP1S30F780C5ES Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, 1 MM PITCH, FBGA-780 | |
| Pin Count | 780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP1S30F780C5ES Datasheet Download
EP1S30F780C5ES Overview
The chip model EP1S30F780C5ES is a highly advanced semiconductor device developed by Altera Corporation. It offers a unique combination of features and benefits that make it an ideal choice for a wide range of applications. The device is designed to be used in high-speed communication systems, with its advanced features and high-performance capabilities. It is also suitable for use in networks and intelligent systems.
The EP1S30F780C5ES chip model offers a number of advantages over other semiconductor devices. It has a high-speed, low-power architecture that is capable of meeting the demands of high-speed communication systems. It also offers a wide range of features, such as a wide range of I/O configurations, programmable logic blocks, and a large memory capacity. Additionally, it is designed to be used in a variety of applications, including networks, intelligent systems, and communication systems.
The chip model EP1S30F780C5ES is expected to be in high demand in the future, as it is a highly advanced semiconductor device. It is capable of meeting the demands of high-speed communication systems and is suitable for use in a variety of applications. Furthermore, its advanced features and high-performance capabilities make it an ideal choice for use in networks and intelligent systems.
The original design intention of the chip model EP1S30F780C5ES is to provide a highly advanced semiconductor device that can meet the demands of high-speed communication systems. It is also designed to be used in a variety of applications, including networks, intelligent systems, and communication systems. Additionally, it is designed to be upgradable, so that it can be used in the future in advanced communication systems.
The chip model EP1S30F780C5ES is expected to have a wide range of applications in the future. It is capable of being used in networks and intelligent systems, and can be used in a variety of applications, such as communication systems, networks, and intelligent systems. Additionally, it is capable of being used in the era of fully intelligent systems, as its advanced features and high-performance capabilities make it an ideal choice for use in these systems.
Overall, the chip model EP1S30F780C5ES is a highly advanced semiconductor device that is capable of meeting the demands of high-speed communication systems. It is also suitable for use in a variety of applications, including networks, intelligent systems, and communication systems. Additionally, it is designed to be upgradable, so that it can be used in the future in advanced communication systems. It is expected to be in high demand in the future, as it is capable of being used in networks and intelligent systems, and can be used in the era of fully intelligent systems.
You May Also Be Interested In
3,454 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||