
Altera Corporation
EP1S30B956I7
EP1S30B956I7 ECAD Model
EP1S30B956I7 Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 726 | |
Number of Outputs | 726 | |
Number of Logic Cells | 32470 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Power Supplies | 1.5,1.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B956 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 956 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA956,31X31,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | BGA, BGA956,31X31,50 | |
Pin Count | 956 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP1S30B956I7 Datasheet Download
EP1S30B956I7 Overview
The chip model EP1S30B956I7 is a highly advanced integrated circuit (IC) designed by Altera Corporation. It is an FPGA chip that is based on a Stratix III architecture and is used in a variety of applications, including embedded systems, communication systems, and industrial automation.
This chip model is designed to provide a high level of performance, flexibility, and scalability. It is capable of processing data at a rate of up to 1.3 Gbps and supports a wide range of communication protocols, including Ethernet, Serial RapidIO, PCI Express, and USB. It is also capable of supporting multiple operating systems, including Windows, Linux, and Mac OS X.
The EP1S30B956I7 is ideal for applications that require high performance, low power consumption, and scalability. It is also suitable for applications that require the integration of multiple communication protocols and operating systems. In addition, it is suitable for applications that require the integration of multiple components, such as memory, microprocessors, and peripherals.
In terms of industry trends, the EP1S30B956I7 is expected to be widely used in the future, as it is designed to meet the needs of a wide range of applications. It is also expected to be used in more advanced communication systems, as it is capable of supporting multiple protocols and operating systems. In terms of future upgrades, the chip model is designed to be upgradeable, allowing users to upgrade their systems as needed.
In terms of product description, the EP1S30B956I7 is a highly advanced FPGA chip that is based on a Stratix III architecture. It is capable of processing data at a rate of up to 1.3 Gbps and supports a wide range of communication protocols, including Ethernet, Serial RapidIO, PCI Express, and USB. It is also capable of supporting multiple operating systems, including Windows, Linux, and Mac OS X.
In terms of actual case studies, the EP1S30B956I7 has been used in a variety of applications, including embedded systems, communication systems, and industrial automation. It has been used in a number of projects, including the development of a wireless sensor network and the design of a surveillance system. It has also been used in the design of a smart home system.
In terms of precautions, it is important to note that the EP1S30B956I7 is a highly advanced chip and should be handled with care. It is important to ensure that the chip is installed correctly and that all the necessary components are present. It is also important to ensure that the chip is properly configured and that all the necessary software is installed.
In conclusion, the EP1S30B956I7 is a highly advanced FPGA chip that is designed to meet the needs of a wide range of applications. It is capable of processing data at a rate of up to 1.3 Gbps and supports a wide range of communication protocols. It is also capable of supporting multiple operating systems, including Windows, Linux, and Mac OS X. In terms of industry trends, it is expected to be widely used in the future and is suitable for applications that require the integration of multiple components. In terms of future upgrades, the chip model is designed to be upgradeable, allowing users to upgrade their systems as needed. Finally, it is important to ensure that the chip is installed correctly and that all the necessary components are present.
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