EP1S30B956I7
EP1S30B956I7
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rohs

Altera Corporation

EP1S30B956I7


EP1S30B956I7
F53-EP1S30B956I7
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA956,31X31,50
BGA, BGA956,31X31,50

EP1S30B956I7 ECAD Model


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EP1S30B956I7 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Inputs 726
Number of Outputs 726
Number of Logic Cells 32470
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Power Supplies 1.5,1.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B956
Qualification Status Not Qualified
JESD-609 Code e0
Peak Reflow Temperature (Cel) 220
Number of Terminals 956
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA956,31X31,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description BGA, BGA956,31X31,50
Pin Count 956
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP1S30B956I7 Datasheet Download


EP1S30B956I7 Overview



The chip model EP1S30B956I7 is a highly advanced integrated circuit (IC) designed by Altera Corporation. It is an FPGA chip that is based on a Stratix III architecture and is used in a variety of applications, including embedded systems, communication systems, and industrial automation.


This chip model is designed to provide a high level of performance, flexibility, and scalability. It is capable of processing data at a rate of up to 1.3 Gbps and supports a wide range of communication protocols, including Ethernet, Serial RapidIO, PCI Express, and USB. It is also capable of supporting multiple operating systems, including Windows, Linux, and Mac OS X.


The EP1S30B956I7 is ideal for applications that require high performance, low power consumption, and scalability. It is also suitable for applications that require the integration of multiple communication protocols and operating systems. In addition, it is suitable for applications that require the integration of multiple components, such as memory, microprocessors, and peripherals.


In terms of industry trends, the EP1S30B956I7 is expected to be widely used in the future, as it is designed to meet the needs of a wide range of applications. It is also expected to be used in more advanced communication systems, as it is capable of supporting multiple protocols and operating systems. In terms of future upgrades, the chip model is designed to be upgradeable, allowing users to upgrade their systems as needed.


In terms of product description, the EP1S30B956I7 is a highly advanced FPGA chip that is based on a Stratix III architecture. It is capable of processing data at a rate of up to 1.3 Gbps and supports a wide range of communication protocols, including Ethernet, Serial RapidIO, PCI Express, and USB. It is also capable of supporting multiple operating systems, including Windows, Linux, and Mac OS X.


In terms of actual case studies, the EP1S30B956I7 has been used in a variety of applications, including embedded systems, communication systems, and industrial automation. It has been used in a number of projects, including the development of a wireless sensor network and the design of a surveillance system. It has also been used in the design of a smart home system.


In terms of precautions, it is important to note that the EP1S30B956I7 is a highly advanced chip and should be handled with care. It is important to ensure that the chip is installed correctly and that all the necessary components are present. It is also important to ensure that the chip is properly configured and that all the necessary software is installed.


In conclusion, the EP1S30B956I7 is a highly advanced FPGA chip that is designed to meet the needs of a wide range of applications. It is capable of processing data at a rate of up to 1.3 Gbps and supports a wide range of communication protocols. It is also capable of supporting multiple operating systems, including Windows, Linux, and Mac OS X. In terms of industry trends, it is expected to be widely used in the future and is suitable for applications that require the integration of multiple components. In terms of future upgrades, the chip model is designed to be upgradeable, allowing users to upgrade their systems as needed. Finally, it is important to ensure that the chip is installed correctly and that all the necessary components are present.



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